Process Engineer Jobs

About The Position

Requirements

• Master's or PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related technical discipline.
• 7+ years of combined industry, research, and/or academic experience.
• Experience with advanced thin-film deposition technologies, including ALD, PEALD, CVD, PECVD, Epitaxy, oxidation, and annealing.
• Experience with DRAM, NAND, or emerging memory device development and integration.
• Experience with high-k dielectrics, metal electrodes, conductive films, barrier materials, and capacitor technologies.
• Experience in semiconductor process integration and materials engineering for advanced memory applications.
• Experience with materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, and ellipsometry.
• Strong understanding of electrical characterization techniques and memory device performance metrics.
• Deep understanding of DRAM and memory device architecture, fabrication flows, and scaling challenges.
• Demonstrated expertise in thin-film deposition and integration for advanced memory structures.
• Ability to independently lead complex process development projects, including technical direction, schedules, budgets, and resource planning.
• Strong knowledge of the relationship between reactor design, process conditions, and film properties.
• Experience integrating advanced dielectric, conductive, and metal films into memory device architectures.
• Ability to develop and fully characterize deposition processes using first-principles understanding and advanced experimental methodologies.
• Expertise in materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman, and ellipsometry.
• Excellent verbal and written communication skills, including the ability to present complex technical concepts to customers, industry partners, and executive stakeholders.
• Demonstrated track record of customer engagement, technology leadership, technical publications, and patent generation.

Nice To Haves

• Experience supporting advanced memory process development for high-volume manufacturing environments.
• Training or experience with Computational Fluid Dynamics (CFD).
• DRAM capacitor development using high-k and metal electrode systems.
• Buried word line (BWL) integration experience.
• High-aspect-ratio deposition and gap-fill experience.
• Experience with capacitor dielectric materials such as ZrO₂, HfO₂, Al₂O₃, and related stacks.
• Advanced patterning and self-aligned integration experience.
• Experience with emerging memory technologies, including MRAM, ReRAM, PCM, or 3D DRAM concepts.
• Direct experience supporting memory manufacturers such as Micron, Samsung, SK hynix, Kioxia, Western Digital, YMTC, or CXMT.

Responsibilities

• Develop and optimize advanced deposition processes for DRAM and emerging memory applications using ALD, PEALD, Epitaxy, and PECVD.
• Drive process innovation for memory-critical films, including high-k dielectrics, capacitor materials, metal electrodes, barrier layers, conductors, and emerging memory materials.
• Support development addressing DRAM scaling challenges, including capacitor formation, buried word lines, advanced patterning, and high-aspect-ratio structures.
• Track memory technology trends and roadmaps to identify process opportunities and technology requirements.
• Serve as a technical consultant and subject matter expert for internal teams and memory manufacturers.
• Lead technical problem-solving using scientific methods, statistical analysis, and industry-standard tools.
• Design and execute experiments using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Analyze electrical, physical, and materials characterization data to understand film properties and device performance.
• Troubleshoot equipment and process issues through experimentation and root cause analysis.
• Collaborate with customers to define requirements, run demonstrations, and develop solutions to memory integration challenges.
• Develop methods for integrating advanced materials into future DRAM and memory device architectures.
• Support product transfers, customer demonstrations, field training, and process documentation.
• Publish technical papers, present at industry conferences, and contribute to ASM’s patent portfolio.
• Mentor engineers and provide technical leadership across memory-focused development programs.
• May provide supervisory direction to process engineering technicians and support personnel.