Process Engineer Jobs

About The Position

Requirements

• Bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other applied engineering discipline
• 5+ years of professional experience in semiconductor assembly and packaging

Nice To Haves

• Advanced technical degree
• 7+ years industry experience with microelectronics packaging development
• Packaging familiarity with flip-chip, BGA, fcCSP, WLCSP, fan out FO processes, system-in-package SiP, multi-chip modules MCM, panel level packaging, heterogenous and chiplet integration
• Hands-on packaging, PCB, PCBA, or SMT assembly experience
• OSAT (outsource semiconductor assembly and test) experience a plus

Responsibilities

• Own packaging assembly processes from concept to mass production including equipment and material selection for wafer-level and chip-level systems
• Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach
• Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
• Own packaging prototypes, product development and release to production
• Select equipment and material to meet quality, reliability, cost, yield, and production targets
• Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements
• Cross-functional interface with IC design, materials, thermal, systems, and production teams
• Implement advanced packaging solutions into SpaceX next generation products