Engineer Jobs

About The Position

Requirements

• Master’s degree in Electrical Engineering, Optical , Computer Engineering, or related field required.
• 15+ years of experience in uLED, uVCSEL as well as ASIC architecture and chiplet design & integration, preferably in networking, and high-performance SoCs.
• Demonstrated leadership in driving complex ASIC or multi-die products from concept through delivery.
• Strong track record of innovation at scale—patents, publications, or industry-recognized contributions.
• Experience talking R&D and early development phase to high volume products.
• Deep expertise in: Delivering and resolving system-level architecture for uLED, photo-diodes, uVCSELs & networking ASICs.
• Multi-die systems and advanced die-to-die protocols
• Chiplet/heterogeneous integration techniques
• High-performance uLED and uVcsel processes and manufacturing & resolving performance & reliability issues.
• Hands-on product development experience with 2.5D/3D optical-electronic integration techniques.
• Familiarity with and working knowledge of the supplier eco-system for highly integrated opto-electronic components and modules.
• Ability to work in an integrated, global team environment.
• Strong understanding of system integration, both hardware and, and full-stack implications.
• Successful track record of design and manufacturing of LED and VCSEL for optical communications and compact sub-systems to high volume production.
• Comfortable operating in a fast-paced, highly innovative environment.
• Hands-on, roll-up-the-sleeves capabilities. Able and interested in the basics and the high strategic level, and everything in between.
• Outstanding Communicator. Superior written and oral communication skills; presents his/her views in a clear and compelling manner. Must be an excellent listener to ensure strong communication with the team. Able to collaborate cross-functionally and globally. Strong consensus-building skills.
• Action-Oriented. A proactive self-starter with commitment who moves programs forward and complete their execution.
• Establishes credibility quickly with both internal and external constituents.
• Effective team player. A highly motivated, collaborative team player who actively contributes to an atmosphere in which people work together, enthusiastically and effectively, to produce outstanding results.
• Professional. Unquestionable integrity, credibility and character.
• Proven mentoring capabilities with a passion for developing engineering talent.

Nice To Haves

• Ph.D. is strongly preferred.

Responsibilities

• Serve as the champion and liaison for advanced development hardware for scale in and scale up for data centers and AI hardware, focused on performance, power efficiency, and silicon leadership.
• Architect multi-die systems, including die-to-die (D2D) interconnects that redefine how large-scale ASICs are built.
• Champion chiplet-based methodologies that increase design modularity, accelerate development cycles, and unlock new product families.

Benefits

• employee stock purchase plan with a 2-year look back
• family support programs to help balance work and home life
• robust mental health resources to prioritize emotional well-being
• recognition and service awards to celebrate contributions and milestones