Mechanical Design Engineer Jobs

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About The Position

The Boeing Company’s Boeing Defense, Space and Security organization is hiring an entry-level (Level 1) Mechanical Product Design and Analysis Engineer for its Space Electronics Packaging team in El Segundo, California. The role contributes to in-house product development throughout the lifecycle, from initial design concepts through prototyping and production. Work includes mechanical printed circuit board design, electronics packaging, and thermal, structural, and vibration analysis for satellite missions and projects involving multichip modules, microelectronics, and electronic systems. The position works closely with satellite and electrical engineering teams and uses the on-site satellite factory to support collaboration and integration of electronics packaging solutions for the space environment. The role works under close supervision and offers opportunities to develop technical and leadership skills. This position is expected to be 100% onsite in El Segundo, California. The successful candidate must be able to obtain a U.S. security clearance; a post-start interim and/or final U.S. Top Secret/SCI clearance is required. U.S. citizenship is required for the government clearance, and the position must also meet U.S. export control compliance requirements. Boeing will not sponsor applicants for employment visas. The role is not safety-sensitive and is not contingent upon a program award. Relocation may be offered based on eligibility. The position’s summary pay range is $79,050–$106,950, with pay dependent on candidate experience and qualifications and market and business considerations. Eligible employees may enroll in benefit programs that generally include health insurance, flexible spending and health savings accounts, retirement savings plans, life and disability insurance, and paid and unpaid time away from work. Available programs and options may vary by eligibility factors.

Requirements

  • Bachelor of Science degree in Engineering with a focus in Electrical, Mechanical, or Aeronautical Engineering; Computer Science; Data Science; Mathematics; Physics; or Chemistry, or non-U.S. equivalent qualifications directly related to the work statement.
  • Experience using Computer-Aided Design (CAD) tools.
  • Ability to obtain a U.S. security clearance; U.S. citizenship is required by the U.S. Government for the clearance, and a post-start interim and/or final U.S. Top Secret/SCI clearance is required.
  • Meet U.S. export control compliance requirements as a U.S. Person.
  • Satisfy the company’s Conflict of Interest assessment process.

Nice To Haves

  • Active U.S. Top Secret/SCI security clearance.
  • Experience in electronic packaging, printed circuit board design and assembly (PCB/PCBA), or thermal, structural, dynamics, and/or vibration analysis and tools.
  • Experience in aerospace or a related industry, or with space electronics.
  • Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics, Mentor Xpedition, Cadence Allegro, or KiCad.
  • Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers.
  • Ability to collect, organize, synthesize, and analyze data; summarize findings; and develop conclusions and recommendations from appropriate data sources.

Responsibilities

  • Coordinate with multidisciplinary groups to develop and understand requirements and create high-level and detailed designs consistent with those requirements.
  • Guide structural design and configuration development by performing trade studies to optimize structures and meet program requirements.
  • Perform detailed structural and thermal analysis using hand calculations and analysis tools.
  • Document structural analyses and data required to demonstrate compliance with Boeing, customer, and regulatory requirements at module, slice, and unit levels.
  • Collaborate with Electrical Engineering to conduct sizing and placement studies and to lay out and route printed circuit boards.
  • Validate designs through reviews, testing, and analysis.
  • Develop, deploy, and support new processes and process improvements to improve engineering task efficiency, reduce cycle time, and drive product improvements.
  • Conduct root cause and corrective action investigations for failures and develop plans going forward.

Benefits

  • Eligible employees may enroll in health insurance programs.
  • Flexible spending accounts and health savings accounts are generally included among benefit programs.
  • Retirement savings plans are generally included among benefit programs.
  • Life and disability insurance programs are generally included among benefit programs.
  • Programs providing paid and unpaid time away from work are generally included among benefit programs.
  • Relocation may be offered based on candidate eligibility.

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