Materials Engineer Jobs

About The Position

Requirements

• For the Senior Engineer level: Bachelor’s degree in Polymer Science, Materials Science and Engineering, or a closely related engineering discipline, plus two years of experience in the semiconductor packaging industry or a closely related industry; alternatively, a master’s degree or higher in one of these fields.
• For the Staff Engineer level: Bachelor’s degree in Polymer Science, Materials Science and Engineering, or a closely related engineering discipline, plus five years of experience in the semiconductor packaging industry or a closely related industry; alternatively, a master’s degree in one of these fields plus three years of relevant industry experience, or a Ph.D. or higher in one of these fields.
• Experience in the semiconductor packaging industry or a closely related industry.
• Hands-on experience in semiconductor packaging materials development, process integration, or related manufacturing technologies, with understanding of industry requirements and technical challenges.
• Strong understanding of advanced semiconductor packaging architectures and technologies, including 2.5D/3D integration, heterogeneous integration, chiplets, wafer-level packaging, and hybrid bonding.
• In-depth knowledge of polymer chemistry, structure-property relationships, adhesion mechanisms, interfacial science, thermal and mechanical properties, and material reliability.
• Proficiency in materials characterization and analytical techniques such as DSC, TGA, DMA, FTIR, and TMA, as well as mechanical testing; ability to interpret results and establish material-performance relationships.
• Ability to independently design and execute experiments, apply DOE methodologies, troubleshoot complex technical challenges, and translate research findings into practical engineering solutions.
• Relevant education and experience may be substituted as appropriate.

Nice To Haves

• Ph.D. in Polymer Science, Materials Science and Engineering, or a closely related engineering discipline.
• Three or more years of experience in the semiconductor packaging industry or a closely related industry.
• Two or more years of experience working on Temporary Bonding and Debonding (TBDB) materials and processes.
• Experience in a startup or research and development (R&D) environment.

Responsibilities

• Develop material formulations and characterize materials for advanced packaging applications.
• Optimize materials and processes using structured Design of Experiments (DOE), data analysis, and root-cause investigations.
• Design and conduct experiments to evaluate material properties, process performance, reliability, and compatibility with advanced packaging technologies.
• Lead material qualification and performance validation for innovative semiconductor packaging material solutions.
• Collaborate with process engineering, equipment development, manufacturing, and external partners to integrate new materials into semiconductor packaging processes.
• Serve as a technical subject matter expert with customers, suppliers, and industry partners; translate technical requirements into material specifications, development roadmaps, and commercially viable solutions.
• Work effectively in a team environment, mentor junior engineers and students, and communicate effectively.
• Perform other duties as assigned.

Benefits

• Competitive health benefits, with employee premiums covered at 100% and family premiums at 50%.
• Voluntary vision, dental, life, and disability insurance options.
• Paid vacation, sick time, and holidays.
• Teachers Retirement System of Texas defined-benefit retirement plan with 8.25% employer matching funds.
• Additional voluntary retirement programs: Tax Sheltered Annuity 403(b) and Deferred Compensation program 457(b).
• Flexible spending account options for medical and childcare expenses.
• Free training access through LinkedIn Learning and professional conference opportunities.
• Tuition assistance.
• Employee discount program, including athletic tickets.
• Free access to UT Austin libraries and museums with staff ID card.
• Free rides on UT Shuttle and Austin CapMetro buses with staff ID card.