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OSI Systems companies have a long history of developing innovative solutions to bring a better quality of life to the world. With more than 30 years of combined experience in the field of optoelectronics our OSI Optoelectronics (OSIO) division is a diversified manufacturer of standard and custom photodiodes and optical sensors for used in aerospace, defense, commercial and medical applications. We are one of the largest global manufacturers of optoelectronic devices, delivering engineering design support and manufacturing capabilities that include products for use in the defense, aerospace, medical, and industrial markets, among others. We utilize our world-class manufacturing facilities in the U.S., India and Malaysia to continue to put forth excellent engineering solutions aligned with efficient manufacturing to meet high-volume production requirements. OSI Optoelectronics is seeking a Wirebond Operator. This individual will be responsible for the set-up, operation, and inspection of ultrasonic and thermosonic wire bonding processes used in the assembly of optoelectronic devices and microelectronic components. They will perform precision work under high magnification, follows blueprints and assembly drawings, and supports product quality, traceability, and production schedules in a controlled manufacturing environment.
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Job Type
Full-time
Career Level
Mid Level
Education Level
High school or GED

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