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GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. In this role, you will collaborate with cross-functional engineering teams to support the development and manufacturing of electro-optical transceivers utilizing GF’s Photonix platform and advanced 2.5D/3D packaging technologies. The engineer will contribute to package integration, process development, reliability characterization, and data analysis activities while gaining hands-on experience in advanced semiconductor packaging technologies. This position offers an opportunity to work alongside experienced engineers and develop technical expertise in silicon photonics, assembly processes, and next-generation packaging solutions.
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Job Type
Full-time
Career Level
Entry Level
Education Level
Ph.D. or professional degree

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