Process Integration Engineer

onsemi•Gresham, OR

About The Position

The Process Integration and Technology Development Engineer defines, develops, and implements silicon process technology for manufacturing integrated silicon devices. The role is responsible for unit and process module development, process flow implementation, design rule definition, device architecture, electrical characterization, and technology qualification. This work supports new silicon technology development and transfers of existing technologies into and out of the resident fab. The position requires experience with semiconductor processing for BCD, Discretes, and hybrid Smart Power technologies, as well as knowledge of semiconductor device functions. The engineer leads process development and optimization, assesses process robustness and manufacturability, and supports reliability, yield, and technology transfer activities. The role works with Process Engineering and Yield Engineering teams and uses data-driven methods to address manufacturing issues and improve technology performance.

Requirements

MS or PhD in Electrical Engineering, Physics, Chemistry, Chemical Engineering, Materials Engineering, or a related technical field.
Minimum of 10 years of experience in semiconductor manufacturing, process development, or process integration in a semiconductor manufacturing environment.
Knowledge of semiconductor processes such as oxidation, implant, deposition (CVD, PECVD, etc.), RIE, CMP, and lithography used in FEOL and BEOL wafer fabrication.
Experience applying DOE, statistical analysis, and data analytics to semiconductor development.
Understanding of semiconductor device physics and construction, including CMOS, DMOS, Bipolar, and Trench FET devices.
Strong written and verbal communication skills, including the ability to clearly convey complex technical concepts.
Proven problem-solving ability and strong collaboration skills in cross-functional teams.

Nice To Haves

Experience with 180 nm through 40 nm technologies.
Knowledge of intrinsic reliability testing methodologies, including GOI, VRamp, TDDB, HCI, EM, and SM.
Hands-on experience with process and device TCAD simulations.
Experience designing and evaluating physical and electrical design rule test structures.
Familiarity with AI/ML techniques, data mining, or statistical modeling applied to semiconductor process or device data.
Experience using scripting languages such as Python, MATLAB, or JMP for data analysis, automation, or model development.

Responsibilities

Lead development of unit processes and process modules for CMOS, BCD, Discretes, and hybrid Smart Power technologies.
Define and assess process module characterization to ensure robustness, manufacturability, and scalability.
Develop and maintain end-to-end technology process flows with detailed process specifications.
Define physical design rules and test structures for characterization.
Drive process and device optimization to meet performance, reliability, and cost targets.
Design and analyze statistical experiments using DOE, regression, and AI-assisted methods to optimize device architecture and process modules.
Support intrinsic reliability studies, including gate oxide integrity, TDDB, HCI, EM, and stress migration, using physics-based and data-driven approaches.
Facilitate process improvements and corrective actions for yield, reliability, and manufacturability issues using root-cause analysis and data mining and analysis.
Support Process Engineering and Yield Engineering teams in improving process quality and yield for technologies released to manufacturing.
Enable technology transfers into and out of the fab using data-driven monitoring, excursion detection, and learning systems.