Packaging Engineer Jobs

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks. MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates. Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure! Packaging Engineer 1 Job Description: RFIC package development, supporting NPI from concept through production release. This individual will work with product and design engineers to deliver optimum, cost effective packaging solutions as well as providing thermal design and analysis for IC package and system level physical designs. Package types include plastic molded leadframe packages, ceramic packages, metal packages, and pallets for RF and Microwave IC’s. This individual may be required to work on multiple product development programs in parallel to deliver packaging solutions on schedule for high volume manufacturing.