Advanced Packaging Design - SI/PI Engineer
About The Position
As a Signal and Power Integrity Engineer on Marvell’s Advanced Packaging design team, you will support customers by developing package designs that meet demanding electrical requirements. The team works on high-speed signaling and power delivery networks, including multi-chip and multiple-component configurations, 3D packaging, co-packaged optics, and advanced substrate materials. The role focuses on signal and power integrity analysis and optimization for 2D, 2.5D, and 3D packages. You will work with product design teams and physical designers to optimize floor-planning, provide package-related design input, and design and verify power delivery networks. You will also conduct wiring studies to determine signal routing, power delivery, and package size. This position is on-site five days per week with an Advanced Packaging design team in Westborough, Massachusetts, or Chandler, Arizona. The position is an individual-contributor role. The expected base pay range is $134,400–$198,910 per annum. The role is eligible for Marvell’s bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
Requirements
- Bachelor’s degree in electrical engineering or a related field and at least 3 years of related professional experience in package or PCB design; or a master’s degree and at least 1 year of related experience; or completion of a Ph.D.
- Knowledge of electrical engineering concepts, circuit extraction, and simulation.
- Understanding of signal integrity and power integrity concepts and fundamentals.
- Experience with simulation and analysis tools such as PowerSI or SIwave.
- Working knowledge of circuit extraction and simulation.
- Familiarity with design methodology and strategies.
- Ability to work with engineers in multiple locations and geographies.
- Strong communication, presentation, and documentation skills.
- Eligibility to access export-controlled information under applicable law; applicants may be subject to an export license review process.
Nice To Haves
- Experience in package development, including interposer design.
- Experience with EDA simulation tools such as Ansys HFSS, Keysight ADS, or Cadence Sigrity tools.
- Familiarity with packaging technologies, materials, package substrate design rules, and assembly rules.
Responsibilities
- Perform signal and power integrity analysis and optimize designs within 2D, 2.5D, and 3D packages.
- Work with product design teams on optimized floor-planning, package-related design input, and power delivery network design.
- Perform wiring studies to determine optimal signal routing, verify power delivery, and determine package size.
- Evaluate package or PCB designs against challenging electrical requirements.
- Work closely with physical designers and IP teams to optimize electrical performance.
- Execute simulation tasks for signal and power integrity sign-off.
Benefits
- Bonus plan eligibility.
- Equity plans, including a new-hire equity grant and annual equity refreshers.
- Employee stock purchase plan with a 2-year look back.
- Family support programs.
- Mental health resources.
- Recognition and service awards.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
