Cisco Silicon One is seeking a Signal and Power Integrity Technical Lead to develop next-generation ASIC packaging for deployment across Cisco platforms. The role focuses on defining, designing, and verifying ASIC packages, including advanced 2.5D packaging and heterogeneous system integration. The lead will develop design rules for ultra-high-speed signaling and analyze substrate signal and power integrity. Working with layout teams, system partners, vendors, and design leads, the role will address technical challenges across interposers, substrates, and PCBs. Responsibilities also include package design and release, simulation and post-layout analysis, defining methods and tools for complex ASIC/package development, and contributing to chip architecture and high-performance ASIC design. The role supports and mentors engineers and promotes design reviews, postmortems, and continuous improvement across engineering teams. The role is based in Cisco’s San Jose, California office, with a preference for candidates able to commute onsite four to five days per week; fully remote candidates may also be considered.
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Job Type
Full-time
Career Level
Senior