Cisco Silicon One is seeking a Signal and Power Integrity Technical Lead to develop next-generation ASIC packaging for deployment across Cisco platforms. The role defines, designs, and verifies ASIC packaging, develops design rules for ultra-high-speed signaling, and analyzes substrate signal and power integrity to help meet product power, performance, and area goals. The position works closely with layout teams and partners on solutions spanning interposers, substrates, and PCBs. The lead designs and documents ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting. The role collaborates with system partners, vendors, and design leads to resolve complex technical issues; defines processes, methods, and tools for complex ASIC/package development; and participates in chip architecture and high-performance ASIC design discussions. The lead also mentors engineers, influences packaging and hardware teams, and promotes design reviews, postmortems, and continuous improvement across multidisciplinary teams. The role is based in Cisco’s San Jose, California office, with a preference for candidates able to commute onsite four to five days per week; fully remote candidates may also be considered.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Job Type
Full-time
Career Level
Senior