Cisco Silicon One is seeking a Signal and Power Integrity Technical Lead to develop next-generation ASIC packaging for deployment across Cisco platforms. The role defines, designs, and verifies ASIC packaging, helping ensure ultra-high-speed signaling meets power, performance, and area goals. It analyzes substrate signal and power integrity and works with layout teams to optimize interposer, substrate, and PCB solutions. The position also develops ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting. The lead collaborates with system partners, vendors, and design leads to achieve combined power and signal integrity and resolve complex technical issues. The role defines processes, methods, and tools for complex ASIC and package development; contributes to chip architecture and high-performance ASIC design discussions; and reviews intricate IC and analog/mixed-signal circuit designs. It also mentors signal integrity and junior engineers, influences packaging and hardware teams, and promotes design reviews, postmortems, and continuous improvement across multidisciplinary engineering teams. The position is based in San Jose, California, and is open to remote applicants residing in the United States.
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Job Type
Full-time
Career Level
Senior