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The HPC DevOps Engineer Intern will support the development and maturation of cloud-bursting capabilities for Corning’s high-performance computing (HPC) environment. The intern will help build and refine Infrastructure as Code templates and CI/CD workflows using AWS, Terraform/OpenTofu, GitLab CI/CD, SLURM, and Python/Bash, advancing an existing development implementation toward Corporate IT production standards. The role involves collaborating with Scientific Computing staff to develop, test, document, and maintain automation for provisioning and operating burst-to-cloud HPC resources. The intern will also support integration of AWS services, IaC tools, CI/CD pipelines, and SLURM scheduling components, and participate in code reviews, troubleshooting, and technical documentation. This is a 10-week internship during Summer 2027 (May–August 2027). Applicants must have a graduation date of December 2027 or later, be willing to work at the posted job location, and be interested in working for Corning after graduation if offered a full-time position. Immigration sponsorship is not supported.
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