Mechanical Engineer Jobs

About The Position

Requirements

• Bachelors + 8 years, or Masters + 6 years, or PhD + 3+ years in mechanical engineering or related field.
• Strong experience in thermomechanical simulation of semiconductor packages and/or board-level assemblies.
• Proven track record in solder joint reliability analysis, including fatigue and/or creep modeling.
• Deep hands-on experience with ABAQUS or ANSYS, including nonlinear material modeling.
• Demonstrated ability to drive technical decisions and work across global teams.

Nice To Haves

• Expertise in board-level reliability (BLR) and PCB–package interaction modeling.
• Professional with solder constitutive models (e.g., Anand) and fatigue life prediction methods (Coffin-Manson, Darveaux).
• Knowledge of JEDEC/IPC standards for reliability qualification.
• Experience with advanced packaging (flip chip, 2.5D/3D, heterogeneous integration).
• Track record of correlating simulation with test data and driving design improvements.

Responsibilities

• Lead and perform advanced finite element analysis (FEA) to evaluate thermomechanical behavior and reliability of ASIC packages and board-level assemblies, including stress, warpage, and interconnect integrity.
• Own and drive solder joint reliability assessments, including thermal cycling, mechanical shock, and vibration, and develop lifetime prediction methodologies.
• Model and analyze nonlinear and time-dependent material behavior, including creep, viscoplasticity, and fatigue, with strong understanding of temperature and rate effects.
• Define and establish simulation methodologies, modeling best practices, and correlation strategies for packaging and board-level reliability.
• Drive correlation between simulation and reliability testing (e.g., TCT, drop, field returns) to improve predictive accuracy and enable design signoff.
• Influence product design by providing data-driven recommendations, risk assessments, and reliability sign-off criteria early in the development cycle.
• Lead root cause analysis for mechanical/reliability failures and guide cross-functional teams toward robust solutions.
• Develop and scale simulation workflows and automation using Python, Fortran, or similar tools to improve team efficiency and consistency.
• Communicate complex technical findings clearly to stakeholders across mechanical, packaging, and system teams.

Benefits

• medical, dental and vision insurance
• a 401(k) plan with a Cisco matching contribution
• paid parental leave
• short and long-term disability coverage
• basic life insurance
• grants of Cisco restricted stock units
• 10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees
• 1 paid day off for employee’s birthday
• paid year-end holiday shutdown
• 4 paid days off for personal wellness determined by Cisco
• Non-exempt employees receive 16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees
• Exempt employees participate in Cisco’s flexible vacation time off program, which has no defined limit on how much vacation time eligible employees may use (subject to availability and some business limitations)
• 80 hours of sick time off provided on hire date and each January 1st thereafter, and up to 80 hours of unused sick time carried forward from one calendar year to the next
• Additional paid time away may be requested to deal with critical or emergency issues for family members
• Optional 10 paid days per full calendar year to volunteer
• annual bonuses subject to Cisco’s policies
• performance-based incentive pay on top of their base salary