Senior Staff Package Design Engineer

Renesas Electronics•Austin, TX

9h•Onsite

About The Position

Renesas is seeking a Senior Staff Package Design Engineer to design and develop package and interconnect methods for power SiP/modules, wafer-level, flip-chip, multi-chip module, and power-device packaging. The role supports consumer, industrial, and automotive power applications and involves package technology qualification, materials and process selection, process optimization, package qualification, production controls, and production ramp-up. The engineer will collaborate with OSATs, contract manufacturers, product groups, reliability, quality, marketing, and operations teams to address technical issues and customer concerns, maintain package design rules, and contribute to packaging roadmaps. The position requires 10–15 years of relevant package development experience and a bachelor's degree in a related engineering or science field; a master's or doctorate is a plus. Renesas is an embedded semiconductor solution provider with a global team of more than 21,000 engineers and problem solvers in over 30 countries. Its culture is grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. This is a regular, non-remote position.

Requirements

Bachelor's degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related field.
10–15 years of relevant experience in package development, emphasizing power SiP/module, wafer-level, and flip-chip packaging.
Strong understanding of power SiP/modules and wafer-level/flip-chip packaging methods.
Assembly process knowledge and experience with qualification methods, SPC, and statistical analysis software.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.

Nice To Haves

Doctorate or master's degree.
Knowledge of wire-bonding and multi-chip module technologies.

Responsibilities

Design and develop package and interconnect methods for power SiP/modules, wafer-level, flip-chip, multi-chip module, and power-device packaging.
Qualify package technologies for consumer and industrial power, as well as automotive power applications.
Benchmark, select, and qualify materials, processes, and assembly subcontractors (OSATs) or contract manufacturers (CMs).
Work with OSATs and CMs to develop processes, run design of experiments (DOE) to optimize processes, and establish process specifications.
Work with product groups and the reliability team to qualify new packages and processes within required time frames.
Resolve process integration issues by ensuring window checks are completed on critical process steps.
Establish production controls and monitor them to prevent quality incidents.
Ensure smooth transitions into production and implement ramp-up monitoring.
Work with OSATs and CMs to monitor and resolve production process issues early so that only high-quality parts are shipped to customers.
Develop and maintain technical expertise in advances and innovations in power SiP/modules, wafer-level packaging, and flip-chip interconnects.
Participate in packaging roadmap development and focus on execution.
Address internal and external customer complaints in collaboration with marketing, product groups, quality, and operations.
Establish and maintain package design rules.

Benefits

Medical benefits.
Health savings account with applicable medical plan.
Dental insurance.
Vision insurance.
Health and/or dependent care flexible spending accounts.
Pre-tax commuter benefits.
Life insurance and AD&D, including company-paid coverage for benefited employees.
Pet insurance.
Long-term disability benefits.
Short-term medical benefits.
Paid sick time.
Paid holidays.
Accrued paid vacation.