Principal Engineer, Package Design

SiTime Corporation•Santa Clara, CA

7d•$164,800 - $226,600

About The Position

The Principal Semiconductor Package Engineer is responsible for specifying, designing, developing, and qualifying custom packaging technology for SiTime’s MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules incorporating custom-designed MEMS and CMOS components. The role leads package design and development through release to production, manages development activities with overseas OSATs, and ensures technologies meet performance, reliability, and quality requirements.

Requirements

Master’s or Ph.D. degree in Mechanical Engineering, Materials Science, or another relevant field.
10+ years of experience in semiconductor IC packaging technology and methodology.
Experience managing overseas OSATs to bring products into production.
Knowledge of leadframe-based, flip-chip, and substrate-based packages.
Experience with flip-chip and bumping technologies.
Understanding of thermal, stress, and electrical considerations in package design.
Hands-on experience with CAD software.
English proficiency, including the ability to communicate, collaborate, and perform job responsibilities in a professional business environment.
Desire to work in a fast-paced, challenging, and risk-taking environment.

Nice To Haves

AutoCAD experience is preferred but not required.
Understanding of thermal, mechanical, and electrical modeling for semiconductor packages.
Understanding of material characterization techniques such as DMA, TMA, and TGA.

Responsibilities

Develop new packaging technology for SiTime’s MEMS-based timing solutions.
Lead package design, development, and release-to-production activities.
Develop, manage, and analyze design of experiments (DoEs) conducted locally and overseas.
Manage development activities at OSATs.
Work with OSATs to prototype and test new custom package designs.
Ensure new technologies meet required performance, reliability, and quality requirements.
Lead troubleshooting activities related to package design or performance.