Principal Package Design Engineering

Renesas Electronics•Plano, TX

2d•Onsite

About The Position

Design and develop package and interconnect methods for Renesas packaging needs, including Power SiP/modules, flip-chip LGA, multi-chip modules with substrates or embedded dies/capacitors, and power device packaging. Qualify package technologies for consumer, industrial, and automotive power applications. Work with OSATs and contract manufacturers to benchmark, select, and qualify materials, processes, and assembly partners; develop and optimize processes through DOE; and establish process specifications. Collaborate with Product groups and Reliability to qualify new packages and processes within required time frames. Resolve process integration issues by completing window checks on critical process steps, establish production controls, and monitor production to prevent quality incidents. Ensure smooth production transition and ramp-up monitoring, and work with manufacturing partners to identify and resolve early production issues so that only high-quality parts are shipped to customers. Maintain expertise in advances in power SiP/modules, wafer-level packaging, and flip-chip interconnects in LGA. Participate in packaging roadmap development and execution, address internal and external customer complaints with cross-functional peers, and establish and maintain package design rules.

Requirements

Doctorate, master's, or bachelor's degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, or Materials Engineering.
10–15 years of relevant experience in package development, emphasizing power SiP/module, wafer-level, and flip-chip LGA packaging.
Strong understanding of power SiP/modules with a substrate or embedded die/capacitor.
Knowledge of assembly processes, qualification methods, SPC, and statistical analysis software.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.

Nice To Haves

Knowledge of Cu FSM/BGBM technologies.

Responsibilities

Design and develop package and interconnect methods for Power SiP/modules, flip-chip LGA, multi-chip modules with substrates or embedded dies/capacitors, and power device packaging.
Qualify package technologies for consumer, industrial, and automotive power applications.
Benchmark, select, and qualify materials, processes, and assembly subcontractors or contract manufacturers.
Work with OSATs and contract manufacturers to develop processes, run DOE to optimize processes, and establish process specifications.
Collaborate with Product groups and the Reliability team to qualify new packages and processes within required time frames.
Resolve process integration issues and ensure window checks are completed for critical process steps.
Establish production controls and monitor them to prevent quality incidents.
Ensure smooth transition into production and implement ramp-up monitoring.
Work with OSATs and contract manufacturers to monitor and resolve early production process issues so that only high-quality parts are shipped to customers.
Develop and maintain technical expertise in power SiP/modules, wafer-level packaging, and flip-chip interconnects in LGA.
Participate in packaging roadmap development and focus on execution.
Address internal and external customer complaints with peers in Marketing, Product groups, Quality, and Operations.
Establish and maintain package design rules.