Principal Package Design Engineering

Renesas Electronics•Tempe, AZ

2d•Onsite

About The Position

Design and develop package and interconnect methods for Renesas packaging needs, including power SiP/modules, flip-chip LGA, multi-chip modules with substrates or embedded dies/capacitors, and power-device packaging. Qualify package technologies for consumer, industrial, and automotive power applications. Work with assembly subcontractors and contract manufacturers to select materials and processes, optimize manufacturing, qualify packages and processes, resolve integration issues, establish production controls, and support a smooth production ramp. Maintain expertise in relevant packaging technologies, contribute to packaging roadmaps, address customer complaints with cross-functional teams, and establish and maintain package design rules.

Requirements

Doctorate, master's, or bachelor's degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, or Materials Engineering.
10–15 years of relevant experience in package development, emphasizing power SiP/module, wafer-level, and flip-chip LGA packaging.
Strong understanding of power SiP/modules involving a substrate or embedded die/capacitor.
Assembly-process knowledge, qualification-method knowledge, and familiarity with SPC and statistical-analysis software.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.

Nice To Haves

Knowledge of Cu FSM/BGBM technologies.

Responsibilities

Design and develop package and interconnect methods for power SiP/modules, flip-chip LGA, multi-chip modules with substrates or embedded dies/capacitors, and power-device packaging.
Qualify package technologies for consumer, industrial, and automotive power applications.
Benchmark, select, and qualify suitable materials, processes, assembly subcontractors (OSATs), and contract manufacturers.
Work with OSATs and contract manufacturers to develop processes, run design of experiments (DOE), optimize processes, and establish process specifications.
Work with Product groups and the Reliability team to qualify new packages and processes within required time frames.
Resolve process-integration issues by ensuring window checks are completed for critical process steps.
Establish production controls and monitor them to prevent quality incidents.
Ensure smooth production transition and implement ramp-up monitoring.
Work with OSATs and contract manufacturers to monitor and resolve process issues early in production and ensure only superior-quality parts are shipped to customers.
Develop and maintain technical expertise in power SiP/modules, wafer-level packaging, and flip-chip interconnects in LGA.
Participate in packaging roadmap development and focus on execution.
Address internal and external customer complaints with Marketing, Product groups, Quality, and Operations peers.
Establish and maintain package design rules.