Principal Package Design Engineering

Renesas Electronics•Plano, TX

About The Position

Design and develop package and interconnect methods for Renesas packaging needs, including power SiP/modules, flip-chip LGA, multi-chip modules with substrates or embedded dies/capacitors, and power-device packaging. Qualify package technologies for consumer, industrial, and automotive power applications. Benchmark, select, and qualify materials, processes, and assembly subcontractors or contract manufacturers. Collaborate with these partners to develop processes, run design of experiments (DOE), optimize processes, and establish process specifications. Work with Product groups and the Reliability team to qualify packages and processes within required time frames. Resolve process integration issues, ensure critical process-step window checks are completed, establish production controls, and monitor controls to prevent quality incidents. Support smooth production transitions and ramp-up monitoring, and work with manufacturing partners to identify and resolve production-stage process issues so that only high-quality parts reach customers. Maintain expertise in power SiP/modules, wafer-level packaging, and flip-chip interconnects in LGA; contribute to packaging roadmaps and execute them. Address internal and external customer complaints with Marketing, Product groups, Quality, and Operations, and establish and maintain package design rules.

Requirements

Doctorate, master’s, or bachelor’s degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, or Materials Engineering.
10–15 years of relevant experience in package development, emphasizing power SiP/module, wafer-level, and flip-chip LGA packaging.
Strong understanding of power SiP/modules involving a substrate or embedded die/capacitor.
Knowledge of assembly processes, qualification methods, SPC, and statistical analysis software.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.

Nice To Haves

Knowledge of Cu FSM/BGBM technologies.

Responsibilities

Design and develop package and interconnect methods for power SiP/modules, flip-chip LGA, multi-chip modules, and power-device packaging.
Qualify package technologies for consumer, industrial, and automotive power applications.
Benchmark, select, and qualify materials, processes, assembly subcontractors (OSATs), and contract manufacturers (CMs).
Work with OSATs and CMs to develop processes, run DOE, optimize processes, and establish process specifications.
Qualify new packages and processes with Product groups and the Reliability team within required time frames.
Resolve process integration issues and ensure window checks are completed for critical process steps.
Establish production controls and monitor them to prevent quality incidents.
Support production transitions and implement ramp-up monitoring.
Work with OSATs and CMs to monitor and resolve early production process issues, ensuring only high-quality parts are shipped to customers.
Maintain technical expertise in power SiP/modules, wafer-level packaging, and flip-chip interconnects in LGA.
Participate in packaging roadmap development and focus on execution.
Address internal and external customer complaints in collaboration with Marketing, Product groups, Quality, and Operations.
Establish and maintain package design rules.