Principal Package Design Engineer

Renesas Electronics•Tempe, AZ

About The Position

Design and develop package and interconnect methods for Renesas packaging needs, including power SiP/modules, flip-chip LGA, multi-chip modules with substrates or embedded dies/capacitors, and power-device packaging. Qualify package technologies for consumer, industrial, and automotive power applications. Benchmark, select, and qualify suitable materials, processes, and assembly subcontractors (OSATs) or contract manufacturers (CMs). Collaborate with OSATs/CMs to develop processes, run design of experiments (DOEs), optimize processes, and establish process specifications. Work with Product groups and the Reliability team to qualify new packages and processes within required timeframes. Resolve process-integration issues by ensuring window checks are completed for critical process steps, establish production controls, monitor them to prevent quality incidents, support smooth production transitions, and implement ramp-up monitoring. Work with OSATs/CMs to identify and resolve production-stage process issues early so that only high-quality parts are shipped to customers. Maintain technical expertise in advances in power SiP/modules, wafer-level packaging, and flip-chip interconnects in LGA. Participate in packaging roadmap development and execute the roadmap. Address internal and external customer complaints in collaboration with Marketing, Product groups, Quality, and Operations. Establish and maintain package design rules. Renesas is an embedded semiconductor solution provider with a global team of more than 21,000 engineers and problem solvers in over 30 countries. Its technology supports Automotive, Industrial, Infrastructure, and IoT applications. Renesas describes its culture as TAGIE: Transparent, Agile, Global, Innovative, and Entrepreneurial. The company states that it offers a competitive benefits package alongside salary, with further information provided during the hiring process. Renesas Electronics is an equal opportunity and affirmative action employer. The role may involve technology subject to U.S. export controls; a U.S. government export license may be required before technology is released to certain persons.

Requirements

Doctorate, master's, or bachelor's degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, or Materials Engineering.
10–15 years of relevant experience in package development, emphasizing power SiP/module, wafer-level, and flip-chip LGA packaging.
Strong understanding of power SiP/modules using a substrate or embedded die/capacitor.
Assembly process knowledge.
Knowledge of qualification methods, SPC, and statistical analysis software.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.

Nice To Haves

Knowledge of Cu FSM/BGBM technologies.

Responsibilities

Design and develop package and interconnect methods for power SiP/modules, flip-chip LGA, multi-chip modules with substrates or embedded dies/capacitors, and power-device packaging.
Qualify package technologies for consumer, industrial, and automotive power applications.
Benchmark, select, and qualify materials, processes, and assembly subcontractors (OSATs) or contract manufacturers (CMs).
Work with OSATs/CMs to develop processes, run DOEs, optimize processes, and establish process specifications.
Collaborate with Product groups and the Reliability team to qualify new packages and processes within required timeframes.
Resolve process-integration issues and ensure window checks are completed for critical process steps.
Establish production controls and monitor them to prevent quality incidents.
Support smooth transitions into production and implement ramp-up monitoring.
Work with OSATs/CMs to monitor and resolve process issues early in production so that only high-quality parts are shipped to customers.
Maintain technical expertise in advances in power SiP/modules, wafer-level packaging, and flip-chip interconnects in LGA.
Participate in packaging roadmap development and focus on its execution.
Address internal and external customer complaints with Marketing, Product groups, Quality, and Operations.
Establish and maintain package design rules.