Sr. Engineer, Package Design

SiTime Corporation•Santa Clara, CA
•$138,800 - $190,850

About The Position

The Senior Semiconductor Package Engineer is responsible for specifying, designing, developing, and qualifying custom packaging technology for SiTime’s MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules incorporating custom-designed MEMS and CMOS components. The role leads package design and development through release to production, working with OSATs and internal and overseas teams to prototype, test, and qualify new designs. The position also supports package performance, reliability, and quality goals and leads troubleshooting related to package design or performance.

Requirements

  • M.S. or Ph.D. in Mechanical Engineering, Material Science, or another relevant field.
  • At least 5 years of experience in semiconductor IC packaging technology and methodology.
  • Experience managing overseas OSATs to bring products into production.
  • Knowledge of leadframe-based, flip-chip, and substrate-based packages.
  • Experience with flip-chip and bumping technologies.
  • Understanding of thermal, stress, and electrical considerations in package design.
  • Hands-on experience with CAD software; AutoCAD is preferred but not required.
  • Desire to work in a fast-paced, challenging, and risk-taking environment.
  • English proficiency, including the ability to communicate, collaborate, and perform job responsibilities effectively in a professional business environment.

Nice To Haves

  • Understanding of thermal, mechanical, and electrical modeling for semiconductor packages.
  • Understanding of material characterization techniques such as DMA, TMA, and TGA.
  • Experience with AutoCAD.

Responsibilities

  • Develop new packaging technology for SiTime’s MEMS-based timing solutions.
  • Lead package design, development, and release-to-production activities.
  • Develop, manage, and analyze DoEs conducted locally and overseas.
  • Manage development activities at OSATs.
  • Work with OSATs to prototype and test new custom package designs.
  • Ensure new technologies meet required performance, reliability, and quality requirements.
  • Lead troubleshooting activities related to package design or performance.

Benefits

  • 401(k) plan
  • Medical insurance
  • Dental insurance
  • Vision insurance
  • Life insurance
  • Parental leave
  • Legal services
  • Time off plans
  • Quarterly bonus tied to achievement of innovation goals
  • Equity grants
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