The Senior Semiconductor Package Engineer is responsible for specifying, designing, developing, and qualifying custom packaging technology for SiTime’s MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules incorporating custom-designed MEMS and CMOS components. The role leads package design and development through release to production, working with OSATs and internal and overseas teams to prototype, test, and qualify new designs. The position also supports package performance, reliability, and quality goals and leads troubleshooting related to package design or performance.
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Job Type
Full-time
Career Level
Senior