About The Position

SpaceX is seeking a motivated, proactive, and intellectually curious engineer to work alongside cross-disciplinary teams spanning systems, firmware, architecture, design, validation, product engineering, and ASIC implementation. The role develops next-generation ASICs for deployment in space and ground infrastructure around the globe, supporting connectivity in places where it has previously been unavailable, unaffordable, or unreliable. As an integral member of the IC design team, the IC Package Design Engineer leads packaging for custom in-house ASICs and RFICs for digital beam formers and modems. The position involves package selection and configuration, package and system-in-package layout, design verification and tapeout, cross-functional coordination, and signal, power, and RF performance optimization.

Requirements

  • Bachelor's degree in electrical engineering, computer engineering, or physics.
  • At least 5 years of experience with IC package design.
  • Ability to work extended hours or weekends as needed to meet mission-critical deadlines.
  • Must meet the stated U.S. Government export-control eligibility requirements or be eligible to obtain required authorizations.

Nice To Haves

  • Experience with Co-packaged Optics (CPO).
  • Thorough understanding of signal and power integrity fundamentals.
  • Substrate design experience for RF, digital, high-speed, and mixed-signal die.
  • Experience with Cadence APD+/SIP or similar design tools.
  • Experience in package-design electrical reviews and SI/PI analysis.
  • Fluency with SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
  • Experience in package-design-for-manufacturing reviews.
  • Familiarity with BGA package substrate technologies.
  • Strong problem-solving skills and engineering fundamentals.

Responsibilities

  • Own and drive advanced package selection, new-product BGA configuration, and package structure.
  • Manage package and system-in-package layout, optimization, design verification, and tapeout.
  • Coordinate with cross-functional groups throughout SpaceX on package selection, feasibility analysis, and design for new products.
  • Work cross-functionally to understand trade-offs and constraints and optimize silicon floor plans, bumps, and package pinouts.
  • Simulate and optimize signal integrity, power integrity, and RF performance of package designs.
  • Drive methodology, innovation, and productivity improvements in package design.
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