Senior Staff Package Design Engineer

Renesas Electronics•Austin, TX

About The Position

Design and develop package and interconnect methods for Renesas packaging needs, including power SiP/modules, wafer-level, flip-chip, multi-chip module, and power-device packaging. Qualify package technologies for consumer, industrial, and automotive power applications. Select and qualify materials, processes, and assembly subcontractors or contract manufacturers, and collaborate with them to optimize processes through design of experiments and establish process specifications. Work with Product groups and the Reliability team to qualify new packages and processes within required time frames. Resolve process integration issues, ensure critical process steps undergo window checks, establish production controls, and monitor quality. Support smooth production transitions and ramp-up, and work with manufacturing partners to identify and resolve production issues early so that only high-quality parts reach customers. Maintain expertise in advances in power SiP/modules, wafer-level packaging, and flip-chip interconnects; contribute to packaging roadmaps and their execution; address customer complaints with cross-functional peers; and establish and maintain package design rules. Renesas is an embedded semiconductor solutions provider with a global team of more than 21,000 engineers and problem solvers in over 30 countries. Its culture is grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas states that it is an equal opportunity and affirmative action employer and is committed to diversity and a discrimination-free work environment. The company handles dual-use technology subject to U.S. export controls, and a government export license may be required before technology is released to certain persons.

Requirements

  • Bachelor of Engineering degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering, or a related field.
  • 10–15 years of relevant package-development experience emphasizing power SiP/module, wafer-level, and flip-chip packaging.
  • Strong understanding of power SiP/modules and wafer-level/flip-chip packaging methods.
  • Knowledge of assembly processes, qualification methods, SPC, and statistical analysis software.
  • Strong interpersonal and communication skills.
  • Strong analytical and presentation skills.

Nice To Haves

  • Doctorate or master's degree.
  • Knowledge of wire-bonding and multi-chip module technologies.

Responsibilities

  • Design and develop package and interconnect methods for power SiP/modules, wafer-level, flip-chip, multi-chip module, and power-device packaging.
  • Qualify package technologies for consumer, industrial, and automotive power applications.
  • Benchmark, select, and qualify materials, processes, and assembly subcontractors or contract manufacturers.
  • Collaborate with OSATs and contract manufacturers to develop and run design-of-experiments studies, optimize processes, and establish process specifications.
  • Work with Product groups and the Reliability team to qualify new packages and processes within required time frames.
  • Resolve process integration issues and ensure window checks are completed for critical process steps.
  • Establish production controls and monitor them to prevent quality incidents.
  • Ensure smooth production transitions and implement ramp-up monitoring.
  • Work with OSATs and contract manufacturers to monitor and resolve production process issues early so that only high-quality parts are shipped to customers.
  • Maintain technical expertise on advances in power SiP/modules, wafer-level packaging, and flip-chip interconnects.
  • Participate in packaging roadmap development and focus on execution.
  • Address internal and external customer complaints with Marketing, Product groups, Quality, and Operations peers.
  • Establish and maintain package design rules.

Benefits

  • Medical benefits and a health savings account with an applicable medical plan.
  • Dental insurance.
  • Vision insurance.
  • Health and/or dependent-care flexible spending accounts.
  • Pre-tax commuter benefits.
  • Life insurance and accidental death and dismemberment coverage.
  • Pet insurance.
  • Company-paid long-term disability and short-term medical benefits for benefited employees.
  • Paid sick time, paid holidays, and accrued paid vacation for benefited employees.
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