Design and develop package and interconnect methods for Renesas packaging needs, including power SiP/modules, wafer-level, flip-chip, multi-chip module, and power-device packaging. Qualify package technologies for consumer, industrial, and automotive power applications. Select and qualify materials, processes, and assembly subcontractors or contract manufacturers, and collaborate with them to optimize processes through design of experiments and establish process specifications. Work with Product groups and the Reliability team to qualify new packages and processes within required time frames. Resolve process integration issues, ensure critical process steps undergo window checks, establish production controls, and monitor quality. Support smooth production transitions and ramp-up, and work with manufacturing partners to identify and resolve production issues early so that only high-quality parts reach customers. Maintain expertise in advances in power SiP/modules, wafer-level packaging, and flip-chip interconnects; contribute to packaging roadmaps and their execution; address customer complaints with cross-functional peers; and establish and maintain package design rules. Renesas is an embedded semiconductor solutions provider with a global team of more than 21,000 engineers and problem solvers in over 30 countries. Its culture is grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas states that it is an equal opportunity and affirmative action employer and is committed to diversity and a discrimination-free work environment. The company handles dual-use technology subject to U.S. export controls, and a government export license may be required before technology is released to certain persons.
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Job Type
Full-time
Career Level
Senior