Senior Director, Package Design & Engineering

NAVITAS SEMICONDUCTOR USA, INC.•Raleigh, NC

About The Position

Navitas Semiconductor is seeking a Senior Director, Package Design & Engineering to lead package architecture, design, development, and qualification across its GaN and SiC portfolio. The role defines the package technology roadmap and guides global engineering execution for advanced discrete and power IC packages from concept through high-volume manufacturing. The leader will bring deep expertise in power semiconductor packaging, assembly processes, materials, simulation, reliability, and new product introduction, while building strong teams and supplier execution and delivering package platforms that meet performance, quality, cost, and schedule commitments. The position owns the global package design and engineering roadmap and leads a global organization spanning package architecture, design, materials, process development, simulation, qualification, and manufacturing readiness. It guides platform development through feasibility, qualification, safe launch, volume ramp, and post-release improvement; establishes engineering requirements and release practices; partners across internal functions; and leads technical engagement with OSATs, suppliers, laboratories, and strategic partners. The role also serves as the senior technical escalation point and represents Navitas in customer technical and executive discussions. The technical scope includes advanced package architectures and optimization of electrical, thermal, mechanical, reliability, manufacturability, and cost performance. The leader guides simulation, material selection and qualification, assembly process development, design and process risk reviews, qualification, failure analysis, package documentation, platform reuse, and OSAT manufacturing readiness. The position also advances technical capability through benchmarking, intellectual property development, external partnerships, and adoption of emerging package and interconnect technologies.

Requirements

M.S. or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, or a related technical discipline.
15+ years of semiconductor package design, package development, assembly process engineering, or power module development experience, including significant technical and people leadership responsibility.
Proven experience taking semiconductor package platforms from concept and design through qualification, production release, and manufacturing ramp.
Deep knowledge of power package architecture, materials, assembly processes, thermal and mechanical behavior, electrical parasitics, qualification, and failure mechanisms.
Demonstrated experience leading multidisciplinary and geographically distributed engineering teams.
Hands-on experience working with OSATs or outsourced manufacturing partners on development, qualification, process capability, yield improvement, and production ramp.
Experience leading complex cross-functional development programs involving device, product, test, reliability, quality, supply chain, operations, suppliers, and customers.
Strong command of structured engineering methods, including DFMEA, DFM, DFR, DOE, SPC, Cpk, design reviews, qualification planning, root-cause analysis, and corrective action.
Excellent communication, technical judgment, executive presentation, organizational leadership, and data-driven decision-making skills.
Ability to travel internationally as required.

Nice To Haves

Package development experience for SiC, GaN, IGBT, MOSFET, integrated power stages, or intelligent power modules.
Experience with a wide range of discrete packages and high-power module platforms.
Experience with advanced interconnect and assembly technologies such as copper clip, flip-chip, aluminum ribbon, high-current wire bonding, and silver sintering.
Experience with thermal, electrical, and mechanical simulation tools such as ANSYS, SolidWorks, or equivalent engineering platforms.
Experience in high-voltage and high-power packaging, including thermal management, current sharing, electric-field management, insulation, creepage and clearance, and partial-discharge mitigation.
Experience with AI data center, industrial, energy storage, renewable energy, or grid-infrastructure applications.
Experience developing package technology roadmaps, reusable design platforms, intellectual property, and global engineering capability during periods of rapid growth.

Responsibilities

Own and execute the global package design and engineering roadmap for GaN and SiC products, aligned with product, technology, and business priorities.
Build, lead, and develop a global organization covering package architecture, design, materials, process development, simulation, qualification, and manufacturing readiness.
Lead package platform development from concept selection and feasibility through design freeze, qualification, safe launch, volume ramp, and post-release improvement.
Establish technical requirements, design rules, development methods, decision gates, and release criteria for package and IC programs.
Create an engineering culture focused on technical excellence, accountability, rapid learning, data-driven decisions, and timely risk and action closure.
Partner with Engineering, Reliability, Quality, Supply Chain, and Business Units to deliver integrated product solutions.
Lead technical engagement with OSATs, material suppliers, tooling and equipment suppliers, external laboratories, and strategic technology partners.
Develop supplier capability and second-source strategies that improve technology access, capacity resilience, cost competitiveness, and continuity of supply.
Serve as senior technical escalation point for package design, assembly, qualification, reliability, and manufacturing issues.
Represent Navitas in customer technical reviews and executive discussions about package architecture, performance, reliability, manufacturability, and development risk.
Define and deliver package architectures for power discretes and IC products.
Optimize package layouts and designs for electrical parasitics, current density, thermal resistance, thermo-mechanical stress, isolation, creepage and clearance, reliability, manufacturability, and cost.
Guide electrical, thermal, electro-thermal, and mechanical simulation, including finite-element analysis, warpage and stress modeling, material-interface assessment, and design sensitivity studies.
Select, characterize, and qualify package materials and components, including leadframes, substrates, die-attach and sintering materials, wires, ribbons, clips, molding and encapsulation compounds, housings, thermal-interface materials, and insulation systems.
Define assembly processes and process windows for die attach, sintering, wire/ribbon/clip bonding, flip-chip attach, molding, encapsulation, substrate attach, housing assembly, cleaning, curing, marking, and traceability.
Lead DFMEA, design reviews, tolerance analysis, DOE, process characterization, SPC, Cpk improvement, cost optimization, and technical risk mitigation throughout development.
Drive qualification planning and execution to applicable JEDEC, AEC-Q, customer, industrial, and internal requirements in partnership with Reliability Engineering.
Lead root-cause analysis and corrective action for package failures, including delamination, die-attach voiding, interconnect degradation, cracking, warpage, moisture ingress, thermal overstress, isolation breakdown, and partial-discharge failures.
Own package documentation, including requirements, drawings, bills of material, process flows, specifications, control plans, qualification reports, and release packages.
Establish package platform reuse and design-rule strategies to accelerate NPI and improve quality, development efficiency, and manufacturing scalability.
Work with Operations to ensure OSAT manufacturing readiness through capability assessments, equipment and tooling readiness, pilot builds, safe launch, yield monitoring, capacity planning, and post-release improvement.
Advance technical capability through competitive benchmarking, intellectual property development, external partnerships, and selective adoption of emerging package and interconnect technologies.
Set a clear technical vision and translate it into an executable roadmap, organization plan, and measurable program commitments.
Develop technical leaders and succession capability across the global package engineering organization.
Promote fact-based decisions, early risk identification, transparent escalation, and disciplined follow-through.
Build strong partnerships across engineering, operations, business teams, suppliers, and customers.
Balance innovation with execution discipline, manufacturability, quality, cost, and speed to market, while modeling Navitas values of ownership, accountability, collaboration, integrity, and respect.