Director Design Engineering

GlobalFoundries•Richardson, TX

About The Position

GlobalFoundries is seeking an experienced Director of Design Engineering to lead development and execution of complex SoC programs across advanced semiconductor technologies. The role drives architectural execution, front-end design methodology, and cross-functional collaboration to deliver differentiated silicon solutions from concept through tape-out and productization. The Director provides technical and organizational leadership for design teams, establishes design methodologies and quality frameworks, and guides decisions involving performance, power, area, reliability, manufacturability, and product cost. The role also defines design strategies for advanced technologies and promotes adoption of low-power architectures, chiplet integration, advanced packaging, and AI-driven design flows. This leader works closely with internal engineering and business groups, customers, ecosystem partners, IP providers, EDA vendors, foundries, and technology partners to align execution with business objectives, schedules, and product roadmaps. The role includes executive communication, program risk assessment, status reporting, and support for Environmental, Health, Safety & Security requirements and programs.

Requirements

Bachelor's, Master's, or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.
15+ years of semiconductor design experience with progressive technical and leadership responsibility.
8+ years of engineering management experience, including leadership of senior technical teams.
Proven track record delivering multiple successful ASIC/SoC tape-outs across advanced technology nodes.
Strong hands-on expertise in front-end design, including RTL design and integration.
Expertise in microarchitecture development, synthesis, CDC/Lint, DFT and test methodologies, timing closure, and collaboration with design verification.
Deep understanding of complete RTL-to-GDSII development flows.
Demonstrated experience with large-scale, complex SoC designs involving multiple IPs, subsystems, and cross-functional teams.
Strong customer-facing and executive communication skills.

Nice To Haves

Experience delivering products on advanced technology nodes such as 7nm, 5nm, 3nm, and beyond.
Experience with AI/ML accelerators, compute platforms, networking, automotive, or high-performance computing products.
Familiarity with advanced packaging technologies, including chiplets, 2.5D, and 3D integration.
Experience working directly with leading foundries and ecosystem partners.
Understanding of low-power design methodologies, power management, and system-level optimization.
Background in customer engagements, strategic partnerships, and technology roadmap development.

Responsibilities

Lead the design and execution of complex SoC, AI/ML, networking, compute, or edge-processing products.
Drive front-end development from architecture definition through RTL implementation, integration, synthesis, timing closure, and tape-out readiness.
Establish and enforce design methodologies, design quality metrics, and execution frameworks.
Use modern AI flows and methodologies for agile and fast design development.
Guide technical decisions involving performance, power, area, reliability, manufacturability, and product cost.
Partner with architecture teams to evaluate product concepts and technology feasibility.
Build, mentor, and lead high-performing design teams across disciplines and geographies.
Develop organizational capabilities across architecture, RTL, integration, verification, DFT, physical design, and silicon bring-up.
Foster technical excellence, accountability, innovation, and execution discipline.
Drive talent acquisition, succession planning, and leadership development.
Collaborate with Architecture, Verification, DFT, Physical Design, Package Design, Software, Product Engineering, Foundry, and Operations teams.
Interface with customers, ecosystem partners, IP providers, EDA vendors, and technology partners.
Align technical execution with business objectives, schedules, and product roadmaps.
Lead reviews, executive communications, risk assessments, and program status reporting.
Define and execute design strategies for advanced semiconductor technologies.
Partner with foundries and ecosystem partners on technology enablement, PDK readiness, IP qualification, and silicon learning.
Drive adoption of advanced design methodologies, low-power architectures, chiplet integration, 2.5D/3D packaging, and emerging AI-driven design flows.
Perform activities safely and responsibly and support Environmental, Health, Safety & Security requirements and programs.