Principal Package Engineer

Microsoft•Redmond, WA

5d•$142,800 - $304,200

About The Position

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) develops infrastructure and foundational technologies for Microsoft’s online businesses and Azure platform. The Compute Silicon & Manufacturing Engineering organization designs, develops, manufactures, and packages Microsoft computer chips, including Azure Cobalt. The Silicon Manufacturing and Product Engineering team works to improve planning, quality, delivery, scale, and sustainability for cloud hardware manufacturing. The Principal Package Engineer supports the silicon development team throughout the product life cycle. The role provides expertise in selecting, qualifying, and manufacturing advanced packaging technology, supporting custom silicon design and implementation, substrate design, package qualification, supplier assessment, manufacturing bring-up, and quality and reliability in development and production. The engineer collaborates across silicon, platform, motherboard, package, thermal, power, and performance disciplines, and drives system and architecture decisions across products and teams.

Requirements

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or a related field and 3+ years of technical engineering experience; or master’s degree in one of these fields and 6+ years of experience; or bachelor’s degree in one of these fields and 8+ years of experience; or equivalent experience.
Ability to meet Microsoft, customer, and/or government security screening requirements, including passing the Microsoft Cloud Background Check upon hire or transfer and every two years thereafter.
Ability to meet export-control eligibility requirements for access to controlled information; the successful candidate must provide proof of citizenship, U.S. residency, or other protected status, with citizenship verified using a valid passport. Applicable alternative documents may be used by lawful permanent residents, refugees, and asylees.

Nice To Haves

Doctorate in Electrical Engineering, Physics, Computer Engineering, Computer Science, or a related field and 5+ years of technical engineering experience; or master’s degree in one of these fields and 8+ years of experience; or bachelor’s degree in one of these fields and 12+ years of experience; or equivalent experience.
15+ years of hands-on experience in semiconductor package design, development, manufacturing, supplier management, or quality management.
Specific experience with advanced semiconductor package technologies such as BGA, 2.5D, or 3D.
Foundation in advanced packaging technologies, manufacturing, and supplier management.
Working knowledge of high-speed signaling, layout, and electrical, mechanical, and thermal co-design.
Working knowledge of test vehicle strategies that cover product design and use conditions, isolate technical risks, and produce actionable data while balancing test coverage, learning objectives, and program timelines.
Experience in thermo-mechanical FEA, including translating simulation results into product design requirements, identifying and quantifying failure risks, guiding design trade-offs, and developing risk-mitigation and validation strategies.
Working knowledge of 2D and 3D simulation tools for full-package layout extractions for power and signal analysis.
Experience with OSAT, supplier, and foundry technologies.
Experience in physical failure analysis.
Experience in subcontract supplier management.
Record of success in a cross-functional team environment.

Responsibilities

Drive optimal silicon packaging solutions supporting the Azure datacenter product roadmap.
Drive package technology for chiplet architectures using advanced 2.5D/3D packaging.
Drive 2.5D/3D package product designs, including bridge, interposer, and substrate, from definition and development through tapeout.
Define, design, and develop test vehicles to validate silicon, package, and system performance.
Assess suppliers and manage them through definition, development, qualification, and production.
Develop and deliver Failure Mode and Effects Analysis (FMEA) for technology options.
Define EDA tool requirements for advanced 3DIC packaging designs.
Design and develop package and assembly drawings to support manufacturing.
Assess and characterize integrated-circuit package reliability.
Work with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
Drive execution of architecture solutions across product lines, product groups, and teams, using cross-functional expertise, industry best practices, and lessons learned.
Drive engineering system-design decisions with internal and external stakeholders, accounting for platform-specific technology choices and developing system models based on current and anticipated needs and trade-offs.