Packaging Module Equipment Development Engineer

Intel•Chandler, AZ

17h•Onsite

About The Position

Intel’s Advanced Packaging Technology Manufacturing organization develops and scales semiconductor packaging solutions for mobile, edge, and high-performance computing applications. The Packaging Module Equipment Development Engineer will develop and optimize semiconductor packaging processes and equipment, supporting Intel’s next-generation roadmap. The position is based in Chandler, Arizona, and requires regular onsite presence to work with equipment, materials, and development tools in Intel’s labs. The engineer will develop advanced assembly processes, design reliability testing simulations, and support standardized manufacturing configurations across Intel factories. The role includes qualifying processes, materials, and hardware; integrating equipment; evaluating reliability under simulated field-use conditions; applying statistical methods to improve manufacturing; coordinating with suppliers and internal teams; identifying quality risks; standardizing factory practices; and documenting technical work and technology transfers. The posting identifies this as an entry-level position for compensation purposes, while also listing minimum experience requirements and preferred experience. The role is an experienced hire and is assigned to Shift 1.

Requirements

Bachelor’s degree in Mechanical, Electrical, Material Science, Chemical Engineering, or a related STEM field, plus 4 or more years of relevant semiconductor industry experience; or a Master’s degree in a matching STEM discipline plus 3 or more years of relevant semiconductor industry experience; or a PhD in a matching STEM discipline plus 6 or more months of relevant semiconductor industry experience.
Experience utilizing SPC or DOE principles in a high-tech manufacturing environment.
Experience managing technical change control, equipment sustaining, or quality data systems.
Structured problem-solving skills, including developing sound hypotheses and data-driven validation plans.
Strong leadership skills to guide cross-functional teams, influence design partners, and manage complex, time-sensitive technical projects.
Exceptional communication and interpersonal skills to consult on packaging improvements and collaborate across diverse matrixed organizations.
Analytical mindset and ability to diagnose complex hardware and process-related challenges.
Self-starter focused on results, with agility to adapt to new methods, tools, and fields of study.

Nice To Haves

Two or more years of hands-on semiconductor packaging process development or equipment engineering experience.
Two or more years managing first-time process integration, tooling selection, or equipment qualifications, specifically involving dispense, mold, or cure hardware.
Two or more years managing complex, time-critical technical projects from development through manufacturing transfer.

Responsibilities

Develop, optimize, and qualify advanced packaging assembly processes, materials, and hardware configurations to meet yield, reliability, and cost requirements.
Manage first-time process integration and equipment selection, with a focus on dispense, mold, and/or cure technologies.
Develop and maintain systems to evaluate silicon and packaging technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic forces.
Lead design of experiments (DOE), apply statistical process control (SPC) methods, and analyze manufacturing data to define process windows and improve productivity.
Establish raw material and tooling specifications and partner with contract assemblers, material vendors, procurement, and supplier quality teams to ensure vendor performance.
Create techniques, quality screens, and acceleration methods to identify quality and reliability risks based on failure mechanisms.
Drive global standardization of product qualifications, manufacturing quality systems, equipment configurations, and process flows across Intel manufacturing sites.
Author technical reports, process specifications, qualification logs, and technical white papers to support technology transfers.
Guide cross-functional teams, influence design partners, and manage complex, time-sensitive technical projects.
Consult on packaging improvements and collaborate across matrixed organizations.