Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of developing cutting-edge packaging processes and equipment that enable Intel's next-generation semiconductor technologies. You will play a critical role in advancing heterogeneous integration and die disaggregation solutions that support Intel's global product roadmap — from high-performance computing to mobile applications. This is a unique opportunity to work alongside world-class engineers, contribute to groundbreaking research and development, and directly influence the future of advanced semiconductor packaging at one of the most recognized technology companies in the world.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Job Type
Full-time
Career Level
Entry Level
Education Level
Ph.D. or professional degree