Packaging Module Development Engineer

Intel CorporationChandler, AZ
$133,800 - $188,890Onsite

About The Position

Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of developing cutting-edge packaging processes and equipment that enable Intel's next-generation semiconductor technologies. You will play a critical role in advancing heterogeneous integration and die disaggregation solutions that support Intel's global product roadmap — from high-performance computing to mobile applications. This is a unique opportunity to work alongside world-class engineers, contribute to groundbreaking research and development, and directly influence the future of advanced semiconductor packaging at one of the most recognized technology companies in the world.

Requirements

  • PhD in a relevant STEM field

Nice To Haves

  • PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or a related STEM field
  • 6+ months of experience: Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
  • 6+ months of experience: Packaging process development and equipment qualification.
  • 6+ months of experience: Analyzing process data, identifying variations, and implementing improvements.
  • Solid knowledge of equipment setup, calibration, and performance evaluation in manufacturing environments.
  • With semiconductor device fabrication and packaging process flows.
  • With managing complex technical projects with a focus on innovation and optimization.
  • Knowledge of quality systems, process documentation, and manufacturing standards.

Responsibilities

  • Develop and qualify advanced packaging processes, materials, and equipment to meet reliability, yield, and cost targets in high-volume manufacturing environments.
  • Design and implement process specifications, prototype workflows, and equipment configurations for emerging packaging technologies.
  • Conduct Design of Experiments (DOE) to analyze process windows and understand interactions between materials, equipment, and chemistry.
  • Drive continuous process improvements to enhance capability, stability, quality, and overall productivity.
  • Collaborate with cross-functional teams — including design, materials, and manufacturing — to resolve complex technical challenges and deliver impactful solutions.
  • Establish material specifications and partner with suppliers to ensure adherence to performance and quality standards.
  • Document technical findings and process innovations through detailed reports and technical papers.
  • Support standardization of manufacturing systems and qualification procedures to ensure consistency and scalability across global operations.
  • Provide sustaining support for equipment performance and process health in high-volume manufacturing settings.

Benefits

  • competitive pay
  • stock bonuses
  • health
  • retirement
  • vacation

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What This Job Offers

Job Type

Full-time

Career Level

Entry Level

Education Level

Ph.D. or professional degree

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