Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

9d•$133,800 - $188,890•Onsite

About The Position

Intel is hiring an entry-level Packaging Module Development Engineer for its Advanced Packaging Technology & Manufacturing team in Arizona. The engineer will develop, optimize, and qualify semiconductor packaging assembly processes and equipment, supporting quality, reliability, yield, and cost goals across product development and high-volume manufacturing. The work includes applying experimental design and statistical methods, developing techniques and selecting materials and tools, managing technical risks with cross-functional teams, and maintaining specifications with suppliers. The role also involves documenting technical findings and improvements and promoting standardization of manufacturing systems, equipment setups, and process flows across Intel sites. The position requires on-site work.

Requirements

Bachelor’s degree in engineering, Physics, Chemistry, or a related STEM field and at least 6 months of relevant industry experience; or a master’s degree in one of these fields and at least 6 months of relevant industry experience; or a PhD in Engineering, Physics, Chemistry, or a related STEM field.
Relevant industry experience may include Statistical Process Control (SPC) and Design of Experiments (DOE).
Relevant industry experience may include hands-on process development, equipment qualification, and characterization in a packaging or manufacturing environment.
Relevant industry experience may include data analysis and risk assessment to support technical decision-making.
Collaborative approach and ability to build relationships across disciplines and organizations.
Intellectual curiosity and an interest in finding better ways to solve problems.
Results orientation, including ability to deliver amid ambiguity or complexity.
Clear communication skills to convey technical findings as actionable insights to diverse audiences.
Adaptability when priorities shift or new challenges emerge.
Commitment to continuous learning and developing skills and knowledge.
Ownership and accountability for work and outcomes.

Nice To Haves

At least 6 months of experience leading technical teams and collaborating across matrixed organizations to drive innovation.
At least 6 months of experience with advanced semiconductor fabrication processes, assembly methodologies, and packaging flows.
At least 6 months of experience or knowledge of machine vision systems, automated inspection, and camera-based measurement techniques.
At least 6 months of experience with programming languages such as Python, MATLAB, or SQL for analyzing complex datasets.

Responsibilities

Develop, optimize, and qualify packaging assembly processes and equipment to meet quality, reliability, yield, and cost targets.
Lead experimental design and process characterization using Design of Experiments (DOE) and Statistical Process Control (SPC) methodologies.
Develop new techniques, materials, and tools to address packaging quality and reliability challenges.
Collaborate with cross-functional teams to identify and mitigate technical risks across product development milestones.
Establish and maintain material and equipment specifications, partnering with suppliers to meet performance and quality standards.
Provide technical consultation and support for packaging challenges in development and high-volume manufacturing environments.
Document technical findings, process improvements, and experimental results in reports, white papers, and qualification documents.
Drive standardization of manufacturing systems, equipment setups, and process flows across Intel sites globally.