Intel’s Packaging Module Development team designs and optimizes assembly and packaging solutions across Intel’s product portfolio. The team collaborates across functions to innovate in manufacturing processes, improve product reliability, and support Intel’s semiconductor technologies. The Packaging Module Equipment Development Engineer will develop and refine processes and equipment for next-generation packaging solutions, supporting manufacturing efficiency, product reliability, and technological innovation. This is an onsite role in Arizona, involving hands-on work with advanced tools and materials and collaboration with internal teams and external vendors.
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Job Type
Full-time
Career Level
Entry Level