Packaging Module Equipment Development Engineer

Intel Corporation•Chandler, AZ

2d•$133,800 - $188,890•Onsite

About The Position

Intel’s Advanced Packaging Technology Manufacturing organization develops and scales semiconductor packaging solutions for mobile, edge, and high-performance computing applications. This onsite role in Arizona focuses on developing and optimizing packaging processes and equipment for Intel’s next-generation roadmap. The engineer develops assembly processes, reliability testing simulations, and standardized manufacturing configurations across global Intel factories, working hands-on with equipment, materials, and development tools in Intel labs. The position involves qualifying packaging processes, materials, and hardware; integrating new processes and selecting equipment; developing reliability evaluation systems; applying statistical methods to optimize manufacturing; and partnering with suppliers and internal teams. It also drives global manufacturing standardization and documents technology qualifications and transfers. The posting describes the position as an entry-level position for compensation purposes, while also listing minimum experience requirements and the job type as Experienced Hire.

Requirements

Bachelor’s degree in Mechanical, Electrical, Materials Science, Chemical Engineering, or a related STEM field and 4+ years of relevant semiconductor industry experience; or a matching STEM master’s degree and 3+ years; or a matching STEM Ph.D. and 6+ months.
Experience using Statistical Process Control (SPC) or Design of Experiments (DOE) principles in a high-tech manufacturing environment.
Experience managing technical change control, equipment sustaining, or quality data systems.
Experience with structured problem solving, developing sound hypotheses, and creating data-driven validation plans.
Strong leadership, communication, and interpersonal skills to guide cross-functional teams and collaborate across organizations.
Analytical problem-solving skills for diagnosing hardware and process challenges.
Self-starter focused on results and able to adapt to new methods, tools, and fields of study.
Ability to work onsite in Arizona.

Nice To Haves

2+ years of hands-on semiconductor packaging process development or equipment engineering experience.
2+ years managing first-time process integration, tooling selection, or equipment qualifications, particularly involving dispense, mold, or cure hardware.
2+ years managing complex, time-critical technical projects from development through manufacturing transfer.

Responsibilities

Develop, optimize, and qualify advanced packaging assembly processes, materials, and hardware configurations to meet yield, reliability, and cost requirements.
Manage first-time process integration and equipment selection, particularly for dispense, mold, and/or cure technologies.
Develop and maintain systems for evaluating silicon and packaging technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic forces.
Design experiments, apply statistical methods such as SPC, and analyze manufacturing data to define process windows and continuously optimize productivity.
Establish raw material and tooling specifications, and work with contract assemblers, material vendors, procurement, and supplier quality teams to ensure vendor performance.
Create techniques, quality screens, and acceleration methods to identify quality and reliability risks early based on failure mechanisms.
Drive global standardization of product qualifications, manufacturing quality systems, equipment configurations, and process flows across Intel manufacturing sites.
Author technical reports, process specifications, qualification logs, and technical white papers to support technology transfers.
Guide cross-functional teams, influence design partners, and manage complex, time-sensitive technical projects.
Consult on packaging improvements and collaborate across matrixed organizations.