Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

1d•$115,110 - $219,550•Onsite

About The Position

The Advanced Packaging Technology and Manufacturing organization is seeking an engineer to develop and sustain metrology systems, measurement methods, and inspection equipment supporting Intel’s advanced packaging and Thermal Compression Bonding technologies. The role applies engineering principles and novel concepts to deliver measurement solutions that improve process control, product quality, reliability, productivity, yield, and manufacturability. The engineer will optimize metrology capabilities in laboratory and manufacturing environments, establish measurement specifications, and work with equipment suppliers and internal development, quality, process, and manufacturing teams. The role also provides technical consultation on measurement challenges and equipment issues, supports lab-to-factory correlation, and helps standardize metrology methods and assess readiness for product milestones. This is an on-site position in Phoenix, Arizona, on Shift 1. Intel describes its compensation package as including competitive pay, stock bonuses, and health, retirement, and vacation benefits. The stated annual salary range for U.S. locations is $115,110 to $219,550.

Requirements

Bachelor's degree in Electrical Engineering, Mechanical Engineering, Physics, Metrology, Instrumentation, Optical Engineering, or a related engineering discipline with at least 4 years of experience; or a master's degree in one of these fields with at least 3 years of experience; or a Ph.D. in one of these fields with at least 1 year of educational or work experience.
Experience in metrology systems development, measurement equipment qualification, calibration, and/or measurement method development in a manufacturing, laboratory, or engineering environment.
Experience with measurement system analysis, including bias, linearity, stability, repeatability, and reproducibility.
Experience with electrical measurements and testing, such as continuity, resistance, leakage, signal integrity basics, or related parametric test methods.
Experience with optical metrology, including microscopes, imaging systems, inspection methods, and/or machine vision.
Experience using data analysis tools such as Python, Excel, SQL, or similar tools for measurement analysis and reporting.
Strong analytical and problem-solving skills.
Ability to lead complex technical initiatives and influence cross-functional teams.
Excellent communication and collaboration skills.
High ownership, accountability, and execution focus.
Passion for innovation and continuous improvement.

Nice To Haves

Experience in semiconductor manufacturing, preferably in advanced packaging.
Experience developing or sustaining metrology systems for process control, product qualification, or reliability evaluation.
Strong background in equipment selection, tool qualification, acceptance testing, and calibration traceability.
Experience with machine vision systems, automated inspection, or camera-based measurement techniques.
Familiarity with lab-to-factory correlation, tool matching, and cross-tool measurement agreement studies.
Experience with DOE, correlation analysis, and method optimization for metrology or test systems.
Knowledge of quality systems, measurement documentation, and standardization of metrology methods.
Experience working with suppliers, vendors, or external calibration or measurement service providers.
Ability to analyze measurement data using statistical methods to identify variation, correlation issues, tool drift, and root causes.

Responsibilities

Optimize metrology capability across laboratory and manufacturing environments by developing and qualifying measurement processes, equipment specifications, calibration methods, and correlation techniques.
Use design of experiments, statistical analysis, and measurement system analysis to improve repeatability, reproducibility, and consistency across tools, sites, and product generations.
Document technical findings and improvements through white papers, reports, and qualification summaries.
Establish measurement specifications and collaborate with equipment suppliers and internal development, quality, process, and manufacturing organizations to ensure measurement capability, traceability, and data integrity meet program needs.
Provide technical consultation on measurement challenges, equipment issues, lab-to-factory correlation, and metrology process improvements.
Support standardization of metrology methods and work with packaging technology development, process engineering, and partner engineering groups to assess readiness and meet product milestones.