Advanced Packaging TD Plating Module Engineer

Intel Corporation•Aloha, OR

8d•$133,800 - $255,200•Onsite

About The Position

As a Module Development Engineer, you will play an integral role in advancing Intel's semiconductor manufacturing capabilities. Your day-to-day responsibilities will focus on developing and optimizing advanced manufacturing processes, performing feasibility studies, and enabling high-volume manufacturing solutions for next-generation device architectures. By driving process innovation and collaborating across teams, your work will directly impact Intel's ability to deliver cutting-edge products and maintain its leadership in the semiconductor industry. You will be part of Intel's Advanced Packaging Technology Development organization, a pioneering team that focuses on creating robust and scalable manufacturing processes to support Intel's innovation in semiconductor technology. This group is instrumental in enabling high-volume production while driving advancements in device performance and reliability, helping Intel achieve its broader goals of technological excellence and industry leadership.

Requirements

Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field with 4+ years of relevant experience.
OR PhD in the same fields with 2+ years of relevant experience.
2+ years of experience in semiconductor processing or advanced packaging technology development and process development methodologies, statistical process control or manufacturing process improvements.

Nice To Haves

Strong technical expertise in areas such as plasma etch, plating processes, or thin-film deposition.
Experience in wafer-level assembly, hybrid bonded interconnects, or advanced packaging technologies.
Demonstrated success in leading programs from strategy formation to high-volume production.
Strong collaboration skills with cross-functional teams, including yield, operations, and supplier management.
Ability to solve complex engineering challenges and drive innovative solutions that align with Intel's strategic goals.

Responsibilities

Develop and optimize advanced manufacturing processes, including material selection, equipment metrology, and system design.
Conduct feasibility studies and simulations to meet device performance and reliability specifications.
Drive process innovation and pathfinding activities to enable next-generation semiconductor architectures.
Collaborate with equipment and material suppliers to design and implement innovative process technologies.
Develop technology roadmaps to guide future manufacturing needs and set industry standards.
Monitor production efficiency and recommend modifications to improve scalability and output.
Utilize statistical process control and data analytics to ensure process stability and continuous improvement.
Partner with cross-functional teams to align on process integration and project deliverables.