Module Development Engineer

Intel•Hillsboro, OR
•Onsite

About The Position

As a Module Development Engineer, you will drive the design and development of advanced semiconductor manufacturing processes and enabling technologies. The role contributes to device development, production efficiency, and Intel's technology roadmap by developing materials, equipment, and process integration strategies. You will work with internal teams and external suppliers to develop and implement manufacturing solutions, including conducting feasibility studies and supporting emerging device architectures.

Requirements

  • PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field.
  • At least 6 months of relevant experience.
  • Fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor materials.
  • Experience with experimental design, data collection, and statistical analysis.
  • Ability to analyze process results and document findings in technical reports and presentations.
  • Strong problem-solving skills and ability to work independently while collaborating in cross-functional teams.
  • Effective written and verbal communication skills in a technical environment.
  • Willingness to work in a fab or lab environment and follow strict safety and contamination control protocols.

Nice To Haves

  • PhD research focus related to plasma etch, pattern transfer, or advanced logic/memory process integration.
  • Hands-on experience with production or pilot line dry etch tools, such as Lam, Applied Materials, TEL, ASM, or Hitachi.
  • Knowledge of advanced-node challenges, including high aspect ratio etching, CD control, etch selectivity, and damage mitigation.
  • Experience with Design of Experiments (DOE) and statistical process control (SPC).
  • Familiarity with process integration, yield learning, or technology development methodologies.
  • Programming or scripting experience for data analysis or automation, such as Python, MATLAB, or JMP.
  • Exposure to foundry or industrial semiconductor research and development environments through internships, collaborations, or joint research programs.
  • Ability to manage multiple experiments or development tasks in a fast-paced, manufacturing-driven research and development setting.
  • Demonstrated interest in transitioning academic research into high-volume manufacturing solutions.
  • Hands-on research experience in dry etch-related topics, such as plasma etching, RIE, ICP, or ALE, through academic research, dissertation work, or internships.
  • Working understanding of semiconductor manufacturing process flows and device structures.
  • Familiarity with semiconductor characterization techniques such as SEM, TEM, AFM, XPS, and ellipsometry.

Responsibilities

  • Develop and optimize advanced manufacturing processes, including material selection, parameter adjustments, equipment metrology, and system design.
  • Conduct feasibility studies and pathfinding activities to support innovative device architectures and manufacturing roadmaps.
  • Design and implement modifications to operating equipment to improve efficiency and production output.
  • Collaborate with equipment and material suppliers to establish enabling technology solutions and integrate them into manufacturing processes.
  • Perform process technology feasibility studies using theoretical simulations and practical engineering methods.
  • Stay informed about industry trends and technological advancements to align manufacturing processes with evolving semiconductor needs.
  • Develop cost-sensitive technology roadmaps in partnership with vendors and internal stakeholders.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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