Module Development Engineer

Intel Corporation•Hillsboro, OR

1d•$133,800 - $188,890•Onsite

About The Position

As a Module Development Engineer, you will help advance Intel's semiconductor manufacturing by designing and developing manufacturing processes and enabling technologies. The role contributes to the development of devices, improvements in production efficiency, and Intel's semiconductor technology roadmap. You will work with internal teams and suppliers to develop materials, equipment, and process integration strategies. The position involves developing and optimizing manufacturing processes, assessing feasibility of new device architectures and process technologies, and modifying operating equipment to improve efficiency and output. You will also collaborate with suppliers and stakeholders on enabling technologies and cost-sensitive roadmaps, while keeping current with industry developments. The work requires analytical and experimental engineering in a fab or laboratory environment with safety and contamination-control protocols. This is an on-site role based in Hillsboro, Oregon. The listed annual salary range is $133,800–$188,890 USD. Intel describes its total compensation package as including competitive pay, stock bonuses, and health, retirement, and vacation benefits.

Requirements

PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field.
At least 6 months of relevant experience.
Fundamental knowledge of plasma physics, surface reactions, thin-film processes, and semiconductor materials.
Experience with experimental design, data collection, and statistical analysis.
Ability to analyze process results and clearly document findings in technical reports and presentations.
Strong problem-solving skills and ability to work independently while collaborating in cross-functional teams.
Effective written and verbal communication skills in a technical environment.
Willingness to work in a fab or lab environment and follow strict safety and contamination-control protocols.

Nice To Haves

PhD research focused on plasma etch, pattern transfer, or advanced logic/memory process integration.
Hands-on experience with production or pilot-line dry etch tools, such as Lam, Applied Materials, TEL, ASM, or Hitachi.
Knowledge of advanced-node challenges such as high-aspect-ratio etching, CD control, etch selectivity, and damage mitigation.
Experience with Design of Experiments (DOE) and statistical process control (SPC).
Familiarity with process integration, yield learning, or technology development methodologies.
Programming or scripting experience for data analysis or automation, such as Python, MATLAB, or JMP.
Exposure to foundry or industrial semiconductor R&D environments through internships, collaborations, or joint research programs.
Ability to manage multiple experiments or development tasks in a fast-paced, manufacturing-driven R&D setting.
Demonstrated interest in transitioning academic research into high-volume manufacturing solutions.
Hands-on research experience with dry-etch topics such as plasma etching, RIE, ICP, or ALE through academic research, dissertation work, or internships.
Working understanding of semiconductor manufacturing process flows and device structures.
Familiarity with semiconductor characterization techniques such as SEM, TEM, AFM, XPS, or ellipsometry.

Responsibilities

Develop and optimize advanced manufacturing processes, including material selection, parameter adjustments, equipment metrology, and system design.
Conduct feasibility studies and pathfinding activities to support innovative device architectures and manufacturing roadmaps.
Design and implement operating-equipment modifications to improve efficiency and production output.
Collaborate with equipment and material suppliers to establish enabling technology solutions and integrate them into manufacturing processes.
Perform process technology feasibility studies using theoretical simulations and practical engineering methods.
Stay informed about industry trends and technological advancements to align manufacturing processes with evolving semiconductor needs.
Develop cost-sensitive technology roadmaps in partnership with vendors and internal stakeholders.