WATD Module Development Engineer

Intel Corporation•Hillsboro, OR
•$155,520 - $298,440•Onsite

About The Position

Intel Corporation is one of the world's leading semiconductor companies, dedicated to designing and manufacturing innovative technology that powers the devices and infrastructure shaping modern life. With a legacy of breakthrough innovation spanning decades, Intel continues to push the boundaries of what's possible — from advanced chip manufacturing to next-generation packaging technologies. At Intel, we believe in the power of human ingenuity, and we're committed to creating an inclusive, collaborative environment where the brightest minds come together to change the world. We are looking for a talented and driven Module Development Engineer to join Intel's Wafer Assembly Technology Development (WATD) group in Oregon. In this high-impact role, you will be at the forefront of advancing Intel's semiconductor manufacturing capabilities, driving the design, development, and optimization of complex processes and equipment. Your work will directly influence Intel's technology roadmap, manufacturing efficiency, and product quality — helping Intel maintain its leadership position in global semiconductor innovation. This is a unique opportunity to work alongside industry experts, collaborate with world-class suppliers, and contribute to technologies that will define the future of computing.

Requirements

  • Bachelor’s degree in mechanical engineering, chemical engineering, materials science, electrical engineering, physics, or a related STEM field with 9+ years of relevant experience; OR Master's degree in a related STEM field with 6+ years of relevant experience; OR PhD in a related STEM field and 4+ years of relevant experience
  • Semiconductor processing, wafer-level assembly, or cleanroom environments
  • Process development methodologies, statistical process control, and manufacturing process improvement
  • Hands-on experience with module engineering, equipment troubleshooting, and preventive maintenance procedures
  • Communicates complex technical concepts clearly and confidently to diverse audiences
  • Thrives in a collaborative, cross-functional team environment
  • Approaches challenges with curiosity, creativity, and a solutions-oriented mindset
  • Demonstrates strong attention to detail and a commitment to quality
  • Adapts quickly to evolving priorities and ambiguous problem spaces
  • Takes ownership of your work and drives initiatives through to completion
  • Builds strong relationships with internal teams, vendors, and industry partners
  • Leads with integrity, humility, and a passion for continuous learning

Nice To Haves

  • 10+ years of experience in leading process development programs from strategy formation to high-volume production
  • Direct experience with semiconductor assembly processes, including pick-and-place, die attach, wire bonding, or flip chip
  • Knowledge of SECS/GEM data streams and SEMI standards for equipment performance tracking
  • Experience with first-of-a-kind (FOK) tools for new technology insertion and supplier collaboration
  • Background in statistical analysis using tools like JMP, Minitab, or Python/pandas

Responsibilities

  • Lead the design and development of advanced manufacturing processes and equipment solutions for next-generation semiconductor products
  • Conduct feasibility studies using theoretical simulations and practical engineering methods to meet device specifications
  • Optimize process integration through material selection, equipment metrology, and parameter settings for new product designs
  • Perform pathfinding activities to develop processes and hardware for innovative device architectures
  • Develop and implement technology roadmaps that support future manufacturing needs
  • Recommend and implement modifications to equipment and manufacturing techniques to improve efficiency, reliability, and output
  • Collaborate with equipment suppliers and materials vendors to develop enabling technologies for advanced manufacturing solutions
  • Design and execute experiments using statistical methodologies (DOE, SPC) to optimize process windows and control strategies
  • Stay current with industry trends, emerging technologies, and process innovations, contributing to Intel's competitive edge

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
© 2026 Teal Labs, Inc
Privacy PolicyTerms of Service