Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

2d•$133,800 - $255,200•Onsite

About The Position

Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and intelligence. With a legacy of over 50 years of technological breakthroughs, Intel is committed to creating world-changing technology that improves the lives of every person on the planet. Our culture is built on inclusion, collaboration, and a relentless pursuit of what's next. At Intel, your work matters — and so do you. Are you passionate about advancing semiconductor packaging technology? Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a Packaging Module Development Engineer specializing in Laser and Optical Processing to join our pilot line in Chandler, Arizona. In this role, you will develop and integrate next-generation laser and optical process technologies that enable Intel's most advanced packaging solutions. Working with world-class engineers and researchers, you will directly influence the performance, reliability, and manufacturability of future semiconductor products.

Requirements

Ph.D. in Optical Engineering, Optics, Photonics, Physics, Applied Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related STEM field (recent graduates with academic lab/dissertation research in laser processing, optics, or laser-material interaction are strongly encouraged to apply); OR Master's degree in the above STEM disciplines with 1+ years of relevant experience (which may include graduate thesis research, academic lab projects, or industry internships); OR Bachelor's degree in the above STEM disciplines with 3+ years of relevant industry experience in laser processing, precision equipment engineering, or semiconductor manufacturing.
Hands-on experience working with laser, optical, photonic, or related advanced processing technologies in a laboratory, manufacturing, or development environment.
Proficiency in programming or scripting tools (e.g., Python, MATLAB, JMP/JSL, C++, LabVIEW) for data analysis, process development, automation, or equipment control.
Experience applying experimental methods (DOE), statistical analysis, and data-driven problem-solving to technical challenges.
Strong analytical, troubleshooting, and communication skills, with attention to detail and a structured approach to process development.
Experience applying experimental methods, statistical analysis, and data-driven problem-solving to technical challenges.

Nice To Haves

4+ years of: Experience developing laser, optical, or precision micromachining processes for semiconductor, microelectronics, advanced materials, or related applications.
Understanding of laser-material interactions (e.g., ultrafast pulse dynamics, non-linear optical absorption, thermal vs. athermal ablation regimes, or laser-assisted surface finishing).
Experience with JMP Scripting Language (JSL) or custom scripting for automated reporting, coordinate translation, toolpath generation, or recipe automation.
Hands-on operation of 3D optical profilers, confocal microscopes, or surface metrology tools to evaluate micro-features, step heights, and surface roughness.
Familiarity with optical modeling tools or multi-physics simulation software (e.g., COMSOL, ANSYS) for thermal or optical-mechanical modeling.

Responsibilities

Develop and optimize laser, optical, and advanced packaging processes for next-generation semiconductor technologies.
Design and execute experiments, analyze data, and drive process improvements using scientific and statistical methods.
Support the installation, qualification, and ramp of new equipment and process technologies.
Investigate process and equipment issues, perform root-cause analysis, and implement solutions to improve yield and reliability.
Collaborate across engineering teams and document technical findings to support technology development and manufacturing readiness.