Advanced Packaging Module Development Engineer

Intel Corporation•Hillsboro, OR

6d•$133,800 - $255,200•Onsite

About The Position

Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and human progress. With decades of pioneering research and development, Intel is at the forefront of designing and manufacturing the world's most advanced chips and technologies. Our Oregon campus in Hillsboro is one of Intel's largest and most strategically important sites globally, serving as a hub for cutting-edge semiconductor research, development, and high-volume manufacturing. At Intel, we believe in the power of human ingenuity and are committed to creating an inclusive, collaborative environment where brilliant minds come together to solve the world's most complex technological challenges. We are seeking a highly motivated and technically skilled Process Integration Engineer to join our dynamic team in Hillsboro, Oregon. In this critical role, you will be at the intersection of innovation and manufacturing, driving technology development and enablement for both high-volume manufacturing and next-generation semiconductor technologies. You will lead the design and development of sophisticated manufacturing processes, perform pathfinding activities for future device architectures, and collaborate with world-class suppliers and internal teams to push the boundaries of what's possible in semiconductor technology. This is a unique opportunity to make a meaningful impact on Intel's strategic roadmap and the broader semiconductor industry.

Requirements

Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related field with 4+ years of relevant industry experience; or a PhD degree in the same fields with 3+ years of relevant experience.
Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
Hands-on experience with robotics, automation systems, vision systems, or image processing.

Nice To Haves

4+ years of experience in: Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
Programming experience in Python or MATLAB.
Troubleshoot complex manufacturing processes and equipment.
Packaging processes, equipment automation development, or project management.
Semiconductor device physics and advanced packaging technologies.

Responsibilities

Drive technology development for high-volume manufacturing and future technology nodes, providing process integration and equipment solutions to meet desired device specifications.
Lead the design and development of technically sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
Perform pathfinding activities in support of process and hardware development, enabling the manufacturing of innovative device architectures, and develop technology roadmaps for future product generations.
Recommend and implement modifications to operating equipment to improve production efficiency, refine manufacturing techniques, and optimize production output for existing products.
Partner with key equipment and materials suppliers to develop and implement enabling elements of technology, building cost-sensitive roadmaps in collaboration with the vendor ecosystem.
Perform process technology feasibility studies through theoretical simulations and practical engineering methods to validate new approaches and technologies.
Remain current on relevant industrial process and material manufacturing technical trends, developing a forward-looking view of Intel's future process technology needs to push the industry forward.
Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to drive data-informed decisions and process improvements.
Leverage hands-on experience with robotics, automation systems, vision systems, and image processing to advance manufacturing capabilities.