Packaging Module Development Engineer

Intel•Chandler, AZ

2d•Onsite

About The Position

Intel is one of the world's most iconic and innovative technology companies, dedicated to designing and manufacturing the foundational semiconductor technologies that power the modern world. From the devices in your pocket to the data centers running the internet, Intel's innovations are everywhere. With a bold vision for the future of computing — spanning artificial intelligence, advanced packaging, and next-generation chip architectures — Intel is transforming what's possible. Our Arizona campuses are among the most advanced semiconductor research, development, and manufacturing facilities on the planet, and they're growing. Join us and be part of something truly world-changing. Are you ready to shape the future of semiconductor technology? We're looking for a talented and driven Packaging Module Development Engineer to join our Advanced Packaging Technology & Manufacturing (APTM) team in Chandler, Arizona. In this role, you'll be at the cutting edge of semiconductor packaging innovation — designing, optimizing, and qualifying the assembly processes and equipment that make Intel's most advanced products possible. You'll work on technologies that power mobile devices, edge computing platforms, and high-performance computing systems used by millions of people around the world. This is your opportunity to make a real, lasting impact on the future of technology.

Requirements

Bachelor’s degree in engineering, Physics, Chemistry, or a related STEM field with 6+ months of relevant industry experience; OR Master’s degree in engineering, Physics, Chemistry, or a related STEM field with 6+ months of relevant industry experience; OR PhD in Engineering, Physics, Chemistry, or a related STEM field.
Relevant industry experience can be any of the following: Statistical Process Control (SPC) and Design of Experiments (DOE).
Hands-on experience with process development, equipment qualification, and characterization in a packaging or manufacturing environment.
Data analysis and risk assessment capabilities to support informed technical decision-making.

Nice To Haves

6+ months of experience: Leading technical teams and collaborating across matrixed organizations to drive innovation.
Advanced semiconductor fabrication processes, assembly methodologies, and packaging flows.
Knowledge of machine vision systems, automated inspection, and camera-based measurement techniques.
Programming languages such as Python, MATLAB, or SQL for analyzing complex datasets.

Responsibilities

Develop, optimize, and qualify packaging assembly processes and equipment to meet world-class quality, reliability, yield, and cost targets.
Lead experimental design and process characterization using Design of Experiments (DOE) and Statistical Process Control (SPC) methodologies.
Innovate new techniques, materials, and tools to address emerging challenges in packaging quality and reliability.
Collaborate with cross-functional teams to identify and mitigate technical risks, ensuring success across product development milestones.
Establish and maintain specifications for materials and equipment, partnering with suppliers to meet performance and quality standards.
Provide technical consultation and support for packaging challenges in both development and high-volume manufacturing environments.
Document technical findings, process improvements, and experimental results in reports, white papers, and qualification documents.
Drive standardization in manufacturing systems, equipment setups, and process flows across Intel sites globally.