Packaging Module Development Engineer

Intel•Chandler, AZ

4d•Onsite

About The Position

Intel's Advanced Packaging Technology Manufacturing (APTM) organization develops and commercializes advanced semiconductor packaging solutions, including scalable, data-driven processes and integrated hardware and software tools. The Packaging Module Development Engineer works at the intersection of metrology engineering, data analytics, and engineering software development, developing and optimizing advanced metrology inspection recipes, building desktop software for precision hardware, and creating automated analysis tools that turn equipment data into manufacturing insights. The role is based in Chandler, Arizona, and requires on-site presence. The engineer develops and maintains desktop applications and automation, manages the full software development lifecycle, and develops, qualifies, and optimizes inspection recipes, equipment parameters, and processes. The role also involves engineering data pipelines and statistical analysis, executing process-control methods and hardware characterization, troubleshooting software and metrology systems, and collaborating with equipment suppliers and cross-functional engineering teams. The position calls for collaborative technical leadership, project management, initiative, and a focus on operational efficiency and quality.

Requirements

Bachelor’s degree in Engineering, Computer Science, Physics, Materials Science, or a related STEM field and 4 or more years of relevant industry experience; OR a master’s degree in a matching STEM discipline and 3 or more years of relevant industry experience; OR a PhD in a matching STEM discipline with no prior professional experience.
Relevant experience in full software development lifecycle activities, including requirements, architecture, coding, testing, deployment, version control, and documentation.
Experience using Python or C#/.NET to build desktop applications, engineering automation, or scientific software.
Experience applying data science skills, including data preparation, statistical analysis, SQL, visualization, SPC, and DOE.
Experience integrating and troubleshooting software, communication interfaces, sensors, or metrology/inspection equipment.
Experience developing or qualifying semiconductor packaging processes, inspection recipes, or manufacturing equipment.

Nice To Haves

1 or more years of experience using PyQt, Tkinter, scientific Python libraries such as NumPy or Pandas, computer vision, or multidimensional image datasets.
1 or more years of experience with advanced packaging flows, metrology systems, or high-volume semiconductor manufacturing environments.
1 or more years of experience managing equipment setups, tool calibrations, recipe optimization, and performance evaluations.

Responsibilities

Design, code, test, deploy, and maintain lightweight desktop applications and automated engineering scripts using Python frameworks such as PyQt or Tkinter, or C#/.NET.
Own the full software development lifecycle, including requirements gathering, architecture, development, testing, version control, technical documentation, and long-term maintenance.
Develop, qualify, and optimize advanced packaging inspection recipes, equipment parameters, and processes to meet yield, quality, and throughput targets.
Create data pipelines to parse equipment outputs, analyze multidimensional datasets, and write structured results to SQL databases.
Execute Design of Experiments (DOE), Measurement System Analysis (MSA), and Statistical Process Control (SPC) to isolate hardware variation and define process windows.
Troubleshoot software applications, equipment interfaces, communications protocols, drivers, sensors, and metrology subsystems.
Collaborate with equipment suppliers and cross-functional engineering teams to resolve tool faults, improve system reliability, and implement corrective actions.