Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

5d•$115,110 - $219,550•Onsite

About The Position

Intel's Advanced Packaging Technology Manufacturing (APTM) organization develops and commercializes advanced semiconductor packaging solutions, delivering scalable, data-driven processes and integrated hardware and software tools for high-performance computing applications. The Packaging Module Development Engineer will work on-site with the team in Chandler, Arizona, at the intersection of metrology engineering, data analytics, and engineering software development. The role focuses on developing and optimizing advanced metrology inspection recipes, creating desktop software to interface with precision hardware, and building automated analysis tools that turn equipment data into manufacturing insights.

Requirements

Bachelor’s degree in Engineering, Computer Science, Physics, Materials Science, or a related STEM field and 4 or more years of relevant industry experience; or a matching STEM master’s degree and 3 or more years of relevant industry experience; or a matching STEM PhD with no prior professional experience.
Relevant experience in one or more of the following: full software development lifecycle; using Python or C#/.NET for desktop applications, engineering automation, or scientific software; data preparation, statistical analysis, SQL, visualization, SPC, or DOE; integrating and troubleshooting software, communications interfaces, sensors, or metrology/inspection equipment; or developing or qualifying semiconductor packaging processes, inspection recipes, or manufacturing equipment.
Ability to solve complex, unstructured problems involving physical hardware, software code, and manufacturing data.
Ability to collaborate effectively across matrixed teams, global engineering groups, and external technical suppliers.
Strong organizational and project-management skills to drive complex, time-sensitive technical projects with minimal supervision.
Self-motivation and a proactive, outcome-driven approach to learning, tool development, operational efficiency, and quality.

Nice To Haves

At least 1 year of experience using PyQt, Tkinter, scientific Python libraries such as NumPy or Pandas, computer vision, or multidimensional image datasets.
At least 1 year of experience with advanced packaging flows, metrology systems, or high-volume semiconductor manufacturing environments.
At least 1 year of experience managing equipment setups, tool calibrations, recipe optimization, and performance evaluations.

Responsibilities

Design, code, test, deploy, and maintain lightweight desktop applications and automated engineering scripts using Python frameworks such as PyQt or Tkinter, or C#/.NET.
Own the full software development lifecycle, including requirements gathering, architecture, code development, testing, version control, technical documentation, and long-term maintenance.
Develop, qualify, and optimize advanced packaging inspection recipes, equipment parameters, and processes to meet yield, quality, and throughput targets.
Build data pipelines to parse raw equipment outputs, statistically analyze multidimensional datasets such as sensor logs, image stacks, and metrology outputs, and write structured results to SQL databases.
Conduct Design of Experiments (DOE), Measurement System Analysis (MSA), and Statistical Process Control (SPC) to isolate hardware variation and define process windows.
Troubleshoot software applications, equipment interfaces, communication protocols, drivers, sensors, and metrology subsystems.
Collaborate with external equipment suppliers and cross-functional engineering teams to resolve tool faults, improve system reliability, and implement corrective actions.
Drive complex, time-sensitive technical projects with minimal supervision and contribute to operational efficiency and quality standards.