As a Module Development Engineer in Intel's Advanced Packaging Technology Development (APTD) Metrology Group, you will contribute to developing, optimizing, and implementing advanced metrology capabilities for next-generation semiconductor packaging technologies. The role combines hands-on equipment and process development, equipment qualification, manufacturing process optimization, and technology development. You will support existing metrology operations and evaluate emerging technologies that can enable future manufacturing capabilities. You will collaborate with cross-functional teams in process integration, module engineering, advanced process control, automation, manufacturing, and equipment suppliers. Your work will help improve manufacturing readiness, equipment performance, and process capabilities while contributing to Intel's long-term technology roadmap. The APTD Metrology Group supports semiconductor technology development programs by enabling advanced measurement and inspection capabilities. Metrology supports process development, yield improvement, and manufacturing readiness as packaging technologies evolve.
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Job Type
Full-time
Career Level
Senior