Packaging Module Equipment Development Engineer

Intel•Chandler, AZ

5d•Onsite

About The Position

Intel's Packaging Module Development team designs and optimizes assembly and packaging solutions across Intel's product portfolio. The Packaging Module Equipment Development Engineer develops innovative processes and refines equipment to advance next-generation packaging solutions, manufacturing efficiency, product reliability, and technology innovation. The role involves hands-on work with advanced tools and materials and supports Intel's technology roadmap and semiconductor manufacturing operations. This is an entry-level, onsite position in Arizona.

Requirements

Bachelor's or master's degree in Engineering, Physics, Chemistry, or a related STEM discipline.
Strong troubleshooting and analytical problem-solving skills, with a focus on continuous improvement using structured experimental methods.
Clear and direct communication skills for consulting on packaging challenges and aligning priorities across internal teams and external vendors.
Self-motivated and organized approach to complex, time-critical technical projects.
Ability to work in a fast-paced, hands-on onsite lab and factory environment.

Nice To Haves

At least 6 months of hands-on semiconductor experience or academic research supporting or developing manufacturing equipment.
At least 6 months of experience with dispense, mold, and/or cure packaging equipment technologies.
At least 6 months of experience applying SPC and/or DOE principles.
At least 6 months of experience with semiconductor fabrication processes, equipment sustaining, change control management, or quality data systems.
At least 6 months of experience managing and delivering results for complex, time-critical technical projects.

Responsibilities

Develop, optimize, and qualify packaging assembly processes and hardware configurations to meet quality, reliability, cost, yield, productivity, and manufacturability targets.
Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to define process and equipment specifications, and document improvements in technical reports and white papers.
Verify the manufacturability of physical package layouts and oversee the lifecycle of manufactured package processes, procedures, and production flows.
Establish material specifications for contract assemblers and raw material vendors, working with supplier quality and procurement teams to ensure adherence to process and qualification standards.
Create acceleration methods, analytical tools, and quality screens to identify and mitigate packaging quality and reliability risks early in development.
Set reliability requirements based on an understanding of failure mechanisms, influencing package design, material selection, and process development.
Standardize product qualification methods and manufacturing quality systems, provide technical consultation to internal partner groups, and respond to customer requests.
Drive technical projects from concept through high-volume manufacturing, taking ownership of technical risk mitigation and product milestones.