As a Module Development Engineer in Intel's Advanced Packaging Technology Development (APTD) Metrology Group, you will help develop, optimize, and implement advanced metrology capabilities for next-generation semiconductor packaging technologies. The role combines hands-on equipment and process development, equipment qualification, manufacturing process optimization, and technology development. You will support existing metrology operations and evaluate emerging technologies that enable future manufacturing capabilities. You will collaborate with process integration, module engineering, advanced process control, automation, manufacturing, and equipment suppliers to improve manufacturing readiness, equipment performance, and process capabilities. The role contributes to Intel's long-term technology roadmap and supports process development, yield improvement, and manufacturing readiness through advanced measurement and inspection capabilities.
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Job Type
Full-time
Career Level
Senior