Packaging Module Equipment Development Engineer

Intel Corporation•Chandler, AZ

10d•$99,030 - $188,890•Onsite

About The Position

Join Intel's Packaging Module Development team and play a pivotal role in pioneering assembly packaging technologies that drive Intel's future advancements. As a Packaging Module Development Engineer, you will develop innovative processes and refine equipment to enable next-generation packaging solutions and enhance US based manufacturing. Your contributions will directly impact manufacturing efficiency, product reliability, and technological innovation, ensuring Intel remains at the forefront of the global semiconductor industry.

Requirements

US Citizenship
Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 1+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field.
Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

Nice To Haves

Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
Experience with high-volume manufacturing including equipment troubleshooting and change qualification
Understanding of semiconductor fabrication processes and packaging technologies.
Familiarity with equipment install and qualification
Experience with optimization of procedures or design for safety, quality and/or cost-effective manufacturability

Responsibilities

Develop and optimize assembly processes and equipment to meet stringent quality, reliability, cost, yield, productivity, and manufacturability goals.
Apply Design of Experiments (DOE) principles and statistical methods to refine processes and specifications, equipment capabilities and gaps, and documenting findings through technical reports.
Ensure manufacturability of physical layouts in package designs, overseeing the lifecycle of manufacturing equipment health and long-term reliability from development through high volume manufacturing
Support integration of new materials and architectures into equipment for manufacturing success for advanced foundry customer product manufacturability
Innovate new techniques, tools, and quality screens to proactively identify and address equipment health and reliability issues.
Lead problem-solving initiatives and continuous improvement efforts for processes and equipment.
Standardize equipment qualification practices and manufacturing quality systems while addressing technical risks aligned with product milestones.