Oregon Advanced Packaging Module Engineer

Intel•Hillsboro, OR

22h•Onsite

About The Position

Intel is seeking an Oregon Advanced Packaging Module Engineer for its Oregon Advanced Packaging team in Hillsboro, Oregon. The role is part of the Wafer Packaging Manufacturing organization, supporting the Aloha and Ronler factories and Intel’s high-volume advanced wafer-level manufacturing and packaging operations. The engineer owns packaging equipment and processes that support device miniaturization and production of next-generation integrated circuits. The position focuses on process control, excursion prevention, global technology transfer, continuous improvement, factory ramp activities, and supplier collaboration. The engineer will work with cross-functional teams and global partners in a fast-paced manufacturing environment, helping ensure safe, precise, high-quality, and productive operations.

Requirements

Meet one of the following education and experience criteria: a bachelor's degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related STEM field and at least 1 year of hands-on experience in semiconductor manufacturing or high-tech process equipment; or a master's degree in a matching STEM discipline.
At least 6 months of experience applying statistical methods, such as Statistical Process Control or design of experiments, to manufacturing processes.
Experience may be acquired through internships, academic projects, coursework, hands-on technical training, or relevant professional work.
Demonstrate analytical problem-solving skills, leadership and collaboration, adaptability in a fast-paced manufacturing environment, and meticulous attention to detail, safety, and design-to-target compliance.

Nice To Haves

At least 6 months of experience troubleshooting equipment or analytical instruments in a semiconductor environment.
At least 6 months of experience using statistical analysis tools such as MATLAB, JMP, or Excel for process optimization.
At least 6 months of experience using materials characterization techniques.

Responsibilities

Manage high-volume manufacturing equipment and processes supporting device miniaturization and production of next-generation integrated circuits.
Conduct technical tests and measurements to maintain critical process control for dimensions and inline defectivity.
Develop, implement, and monitor excursion-prevention and discrepant-material detection systems within equipment modules.
Partner with global Intel manufacturing sites to transfer process qualification outcomes, coordinate training, and align performance metrics.
Lead engineering initiatives focused on safety, quality, productivity, cost reduction, and systematic defect reduction.
Coordinate equipment installations, conversions, and qualifications during factory ramps to bring tooling online safely and on schedule.
Collaborate with equipment and material suppliers to optimize tool configurations and materials for high-volume manufacturing.