Oregon Advanced Packaging Module Engineer - Laser

Intel•Hillsboro, OR

3d•Onsite

About The Position

Intel is hiring a Module Engineer for its Oregon Advanced Packaging (ORAP) team, part of the Wafer Packaging Manufacturing organization, supporting the Aloha and Ronler factories in Hillsboro, Oregon. The role contributes to advanced semiconductor manufacturing by owning high-volume packaging equipment and processes that enable manufacturability and mass production of integrated circuits. It offers the opportunity to develop process controls, lead continuous improvement, and work with advanced manufacturing systems supporting Intel’s production roadmap. The engineer works in a fast-paced, high-volume manufacturing environment and collaborates across teams, global manufacturing sites, and suppliers. The position requires attention to safety, quality, precision, and compliance with design-to-target standards. The role requires on-site presence and is listed as Shift 1.

Requirements

Bachelor’s degree in Electrical Engineering, Physics, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, or a related STEM field, plus at least 1 year of hands-on experience in semiconductor manufacturing or high-tech process equipment; alternatively, a master’s degree in a matching STEM discipline.
Relevant experience may include prior laser processing or process development, or academic or professional experience from internships, academic projects, coursework, or hands-on technical training.
Technical leadership and collaboration skills, including the ability to guide cross-functional teams and work effectively across organizational boundaries.
Analytical problem-solving skills for diagnosing complex electromechanical and process issues using structured data.
Ability to adapt to a rapidly changing, fast-paced high-volume manufacturing environment.
Attention to detail and commitment to precision, safety, and compliance with design-to-target standards.

Nice To Haves

At least 6 months of experience with technical documentation.
At least 6 months of cleanroom experience.
At least 6 months of wafer-level packaging experience.
At least 6 months of semiconductor singulation experience.
At least 6 months of experience troubleshooting equipment or analytical instruments in a semiconductor environment.
At least 6 months of experience using statistical analysis tools such as JMP or SQL.

Responsibilities

Own high-volume packaging equipment and manage processes to enable high-volume manufacturability of Intel and external products; drive closure of critical projects and deliverables.
Conduct new product introduction, process development and optimization, and inline metrology for process control.
Develop, implement, and monitor systems for excursion prevention and discrepant material detection within equipment modules.
Work with global Intel manufacturing sites to transfer process qualification outcomes, coordinate training, and align performance metrics.
Lead engineering initiatives focused on safety, quality, productivity, cost reduction, and systematic defect reduction.
Coordinate equipment installations, conversions, and qualifications during factory ramps to bring tooling online safely and on schedule.
Collaborate with equipment and material suppliers to optimize and upgrade tool configurations and materials for high-volume manufacturing.