Oregon Advanced Packaging Module Engineer - Laser

Intel Corporation•Hillsboro, OR

5d•$89,010 - $125,660•Onsite

About The Position

Intel is seeking a Module Engineer for its Oregon Advanced Packaging team in Hillsboro, Oregon. The role is part of the Wafer Packaging Manufacturing organization, which supports the Aloha and Ronler factories and delivers advanced wafer-level manufacturing and packaging solutions for high-volume production, global technology transfer, and future computing technologies. The engineer will own high-volume packaging equipment and processes that support manufacturability of Intel and external products. The position focuses on laser-related processing, process development and optimization, process controls, and inline metrology. It also involves preventing process excursions, transferring qualified processes to global manufacturing sites, leading improvement initiatives, coordinating equipment installations and qualifications during factory ramps, and working with suppliers to optimize tools and materials. The position is onsite in Hillsboro, Oregon, and is listed as Shift 1.

Requirements

Bachelor’s degree in Electrical Engineering, Physics, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, or a related STEM field, plus at least 1 year of hands-on experience in semiconductor manufacturing or high-tech process equipment; alternatively, a master’s degree in a matching STEM discipline.
Relevant experience may include laser processing or process development, or academic or professional experience gained through internships, academic projects, coursework, or hands-on technical training.
Strong analytical problem-solving ability, including diagnosing complex electromechanical and process issues using structured data.
Leadership and collaboration skills to guide cross-functional teams and work with global partners across organizational boundaries.
Ability to work in a rapidly changing, fast-paced high-volume manufacturing environment and adapt to ambiguity.
Attention to precision, safety, detail, and compliance with design-to-target standards.

Nice To Haves

At least 6 months of experience with technical documentation.
At least 6 months of cleanroom experience.
At least 6 months of wafer-level packaging experience.
At least 6 months of semiconductor singulation experience.
At least 6 months of experience troubleshooting equipment or analytical instruments in a semiconductor environment.
At least 6 months of experience using statistical analysis tools such as JMP or SQL.

Responsibilities

Own high-volume packaging equipment and manage processes to enable high-volume manufacturability of Intel and external products; drive closure on critical projects and deliverables.
Perform new product introduction, process development and optimization, and inline metrology for process control.
Develop, implement, and monitor systems for excursion prevention and discrepant material detection within equipment modules.
Partner with global Intel manufacturing sites to transfer process qualification outcomes, coordinate training, and align performance metrics.
Lead engineering initiatives focused on safety, quality, productivity, cost reduction, and systematic defect reduction.
Coordinate equipment installations, conversions, and qualifications during factory ramps to bring tooling online safely and on schedule.
Collaborate with equipment and material suppliers to optimize and upgrade tool configurations and materials for high-volume manufacturing.