Oregon Advanced Packaging Module Engineer

Intel Corporation•Hillsboro, OR

1d•$76,390 - $146,440•Onsite

About The Position

At Intel, the Oregon Advanced Packaging (ORAP) team supports the Aloha and Ronler factories as part of the Wafer Packaging Manufacturing organization. Its mission is to deliver manufacturing solutions through advanced wafer-level processes and packaging technologies, enable high-volume production, support global technology transfer, and drive innovations in computing. The Oregon Advanced Packaging Module Engineer works in Intel’s advanced manufacturing operations in Hillsboro, Oregon, owning high-volume packaging equipment and processes that enable miniaturization and mass production of integrated circuits. The role includes designing process controls, executing continuous improvement initiatives, and working with advanced manufacturing systems that support Intel’s global production roadmap.

Requirements

Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related STEM field and 1+ years of hands-on experience in semiconductor manufacturing or high-tech process equipment; OR a master’s degree in a matching STEM discipline.
At least 6 months of experience applying statistical methods, such as Statistical Process Control or design of experiments, to manufacturing processes.
Relevant experience may be acquired through internships, academic projects, coursework, or hands-on technical training.
Leadership skills to guide cross-functional teams, influence global partners, and work across organizational boundaries.
Analytical problem-solving skills and interest in diagnosing complex electromechanical and process issues using structured data.
Ability to adapt to a rapidly changing, fast-paced high-volume manufacturing environment.
Attention to detail and commitment to precision, safety, and compliance with design-to-target standards.

Nice To Haves

At least 6 months of experience troubleshooting equipment or analytical instruments in a semiconductor environment.
At least 6 months of experience using statistical analysis tools such as MATLAB, JMP, or Excel for process optimization.
At least 6 months of experience using materials characterization techniques.

Responsibilities

Manage high-volume manufacturing equipment and processes to support device miniaturization and production of next-generation integrated circuits.
Conduct technical tests and measurements to maintain critical process control for dimensions and inline defectivity.
Develop, implement, and monitor systems for excursion prevention and discrepant material detection within equipment modules.
Partner with global Intel manufacturing sites to transfer process qualification outcomes, coordinate training, and align performance metrics.
Lead engineering initiatives focused on safety, quality, productivity, cost reduction, and systematic defect reduction.
Coordinate equipment installations, conversions, and qualifications during factory ramps to bring tooling online safely and on schedule.
Partner with equipment and material suppliers to optimize tool configurations and materials for high-volume manufacturing.